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AD7416AR-REEL PDF预览

AD7416AR-REEL

更新时间: 2024-01-07 03:35:18
品牌 Logo 应用领域
亚德诺 - ADI 传感器换能器温度传感器输出元件
页数 文件大小 规格书
20页 291K
描述
10-Bit Digital Temperature Sensor (AD7416) and Single/Four-Channel ADC (AD7417/AD7418)

AD7416AR-REEL 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ObsoleteReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.76转换器类型:ADC, SUCCESSIVE APPROXIMATION
JESD-609代码:e0最大线性误差 (EL):0.0977%
模拟输入通道数量:1位数:10
功能数量:1输出位码:BINARY
输出格式:SERIAL峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified采样并保持/跟踪并保持:TRACK
端子面层:TIN LEAD处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

AD7416AR-REEL 数据手册

 浏览型号AD7416AR-REEL的Datasheet PDF文件第3页浏览型号AD7416AR-REEL的Datasheet PDF文件第4页浏览型号AD7416AR-REEL的Datasheet PDF文件第5页浏览型号AD7416AR-REEL的Datasheet PDF文件第7页浏览型号AD7416AR-REEL的Datasheet PDF文件第8页浏览型号AD7416AR-REEL的Datasheet PDF文件第9页 
AD7416/AD7417/AD7418  
ABSOLUTE MAXIMUM RATINGS1  
(TA = 25°C, unless otherwise noted.)  
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V  
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V  
Analog Input Voltage to AGND  
8-Lead SOIC Package, Power Dissipation . . . . . . . . . 450 mW  
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
MSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW  
A
IN1 to AIN4 . . . . . . . . . . . . . . . . . . . 0.3 V to VDD + 0.3 V  
Reference Input Voltage to AGND2 . . 0.3 V to VDD + 0.3 V  
Digital Input Voltage to DGND . . . . . 0.3 V to VDD + 0.3 V  
Digital Output Voltage to DGND . . . . 0.3 V to VDD + 0.3 V  
Operating Temperature Range  
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
NOTES  
A Version . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to +125°C  
B Version . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to +85°C  
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW  
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
2 If the reference input voltage is likely to exceed VDD by more than 0.3 V (e.g.,  
during power-up) and the reference is capable of supplying 30 mA or more, it is  
recommended to use a clamping diode between the REFIN pin and VDD pin. The  
diagram below shows how the diode should be connected.  
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W  
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260°C  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW  
REF  
V
DD  
IN  
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
BAT81  
AD7417  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although the  
AD7416/AD7417/AD7418 features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions  
are recommended to avoid performance degradation or loss of functionality.  
–6–  
REV. G  

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