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AD7414ARMZ-1REEL7 PDF预览

AD7414ARMZ-1REEL7

更新时间： 2024-02-28 11:45:36
品牌 Logo 应用领域
罗彻斯特 - ROCHESTER 输出元件传感器换能器
页数 文件大小 规格书
20页 497K
描述
Serial Switch/Digital Sensor, 10 Bit(s), 3Cel, Square, Surface Mount, MO-187AA, MSOP-8

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AD7414ARMZ-1REEL7 技术参数

生命周期：Contact ManufacturerReach Compliance Code：unknown
风险等级：5.77Is Samacsys：N
最大精度（摄氏度）：3 Cel主体宽度：3 mm
主体高度：0.95 mm主体长度或直径：3 mm
外壳：PLASTIC安装特点：SURFACE MOUNT
位数：10最大工作电流：1.2 mA
最高工作温度：125 °C最低工作温度：-40 °C
输出接口类型：2-WIRE INTERFACE封装形状/形式：SQUARE
传感器/换能器类型：TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL最大供电电压：5.5 V
最小供电电压：2.7 V表面贴装：YES
端接类型：SOLDERBase Number Matches：1

AD7414ARMZ-1REEL7 数据手册

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C
 ꢂ74ꢀ4/ ꢂ74ꢀ.  
 -SOLUTECM XIMUMCR TINGSC  
Table 2.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VDD to GND  
−0.3 V to +7 V  
−0.3 V to +7 V  
−0.3 V to +7 V  
−0.3 V to +7 V  
−0.3 V to +7 V  
−40°C to +12ꢀ°C  
−6ꢀ°C to +1ꢀ0°C  
1ꢀ0°C  
SDA Input Voltage to GND  
SDA Output Voltage to GND  
SCL Input Voltage to GND  
ALERT Output Voltage to GND  
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
ꢀ-Lead SOT-23 (RJ-ꢀ)  
Power Dissipation1, 2  
Thermal Impedance3  
θJA, Junction-to-Ambient  
(still air)  
WMAX = (TJMAX − TA)/θJA  
240°C/W  
6-Lead SOT-23 (RJ-6)  
Power Dissipation1, 2  
Thermal Impedance3  
WMAX = (TJMAX − TA)/θJA  
190.4°C/W  
θJA, Junction-to-Ambient  
(still air)  
8-Lead MSOP (RM-8)  
Power Dissipation1, 2  
Thermal Impedance3  
WMAX = (TJMAX − TA)/θJA  
θJA, Junction-to-Ambient  
(still air)  
θJC, Junction-to-Case  
IR Reflow Soldering  
Peak Temperature  
20ꢀ.9°C/W  
43.74°C/W  
220°C (0°C/ꢀ°C)  
10 sec to 20 sec  
3°C/s max  
Time at Peak Temperature  
Ramp-up Rate  
Ramp-down Rate  
−6°C/s max  
Ramp from 2ꢀ°C to Peak  
Temperature  
6 minutes max  
IR Reflow Soldering in Pb-Free  
Package  
Peak Temperature  
Time at Peak Temperature  
Ramp Rate  
260°C (0°C)  
20 sec to 40 sec  
3°C/s max  
Ramp-Down Rate  
−6°C/s max  
Ramp from 2ꢀ°C to Peak  
Temperature  
8 minutes max  
1 Values relate to package being used on a standard 2-layer PCB.  
2 TA = ambient temperature.  
3 Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, such as components mounted on a heat sink.  
Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted  
components.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the  
human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. E | Page ꢀ of 20  
 
 
 
 
 
 
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