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AD660ARZ PDF预览

AD660ARZ

更新时间: 2024-02-29 08:32:51
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
12页 428K
描述
Monolithic 16-Bit Serial/Byte DACPORT

AD660ARZ 技术参数

Source Url Status Check Date:2013-05-01 14:56:15.802是否无铅: 含铅
是否Rohs认证: 不符合生命周期:Active
零件包装代码:DIP包装说明:DIP, DIP24,.3
针数:24Reach Compliance Code:not_compliant
ECCN代码:3A001.A.2.CHTS代码:8542.39.00.01
风险等级:5.16Is Samacsys:N
最大模拟输出电压:10 V最小模拟输出电压:-10 V
转换器类型:D/A CONVERTER输入位码:BINARY
输入格式:SERIAL, PARALLEL, 8 BITSJESD-30 代码:R-GDIP-T24
JESD-609代码:e0最大线性误差 (EL):0.0061%
标称负供电电压:-15 V位数:16
功能数量:1端子数量:24
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DIP
封装等效代码:DIP24,.3封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT APPLICABLE
电源:5,+-15 V认证状态:Not Qualified
座面最大高度:5.08 mm最大稳定时间:13 µs
标称安定时间 (tstl):2.5 µs子类别:Other Converters
最大压摆率:18 mA标称供电电压:15 V
表面贴装:NO技术:BICMOS
温度等级:MILITARY端子面层:Tin/Lead (Sn63Pb37)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT APPLICABLE
宽度:7.62 mmBase Number Matches:1

AD660ARZ 数据手册

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AD660  
GROUNDING  
the digital ground plane to DGND keeping lead lengths as short  
as possible. Then connect AGND and DGND together at the  
AD660. If multiple AD660s are used or the AD660 shares ana-  
log supplies with other components, connect the analog and  
digital returns together once at the power supplies rather than at  
each chip. This single interconnection of grounds prevents large  
ground loops and consequently prevents digital currents from  
flowing through the analog ground.  
The AD660 has two pins, designated analog ground (AGND)  
and digital ground (DGND.) The analog ground pin is the  
“high quality” ground reference point for the device. Any exter-  
nal loads on the output of the AD660 should be returned to  
analog ground. If an external reference is used, this should also  
be returned to the analog ground.  
If a single AD660 is used with separate analog and digital  
ground planes, connect the analog ground plane to AGND and  
OUTLINE DIMENSIONS  
Dimensions shown in inches and (mm).  
N-24  
24-Lead Plastic DIP  
2
4
13  
0.280 (7.11)  
PIN 1  
0.240 (6.10)  
12  
1
1.275 (32.30)  
1.125 (28.60)  
0.325 (8.25)  
0.300 (7.62)  
0.060 (1.52)  
0.015 (0.38)  
0.195 (4.95)  
0.115 (2.93)  
0.210  
(5.33)  
MAX  
0.150  
(3.81)  
MIN  
0.200 (5.05)  
0.125 (3.18)  
0.015 (0.381)  
0.008 (0.204)  
SEATING  
PLANE  
0.100  
(2.54)  
BSC  
0.022 (0.558)  
0.014 (0.356)  
0.070 (1.77)  
0.045 (1.15)  
Q-24  
24-Lead Cerdip  
0.005 (0.13) MIN  
2
0.098 (2.49) MAX  
1
3
4
0.310 (7.87)  
PIN 1  
0.220 (5.59)  
1
12  
0.320 (8.13)  
1.060 (26.92) MAX  
0.290 (7.37)  
0.060 (1.52)  
0.015 (0.38)  
0.200  
(5.08)  
MAX  
0.150  
(3.81)  
MIN  
0.015 (0.38)  
0.008 (0.20)  
15°  
0.200 (5.08)  
0.125 (3.18)  
0°  
0.100  
(2.54)  
BSC  
0.070 (1.78)  
0.030 (0.76)  
0.023 (0.58)  
0.014 (0.36)  
SEATING  
PLANE  
R-24  
24-Lead Small Outline (SOIC)  
24  
13  
0.2992 (7.60)  
0.2914 (7.40)  
0.4193 (10.65)  
PIN 1  
0.3937 (10.00)  
12  
1
0.1043 (2.65)  
0.6141 (15.60)  
0.0926 (2.35)  
0.0291 (0.74)  
0.5985 (15.20)  
x 45°  
0.0098 (0.25)  
0.0500 (1.27)  
0.0157 (0.40)  
8
0
°
°
0.0118 (0.30)  
0.0040 (0.10)  
0.0500  
(1.27)  
BSC  
0.0192 (0.49)  
0.0138 (0.35)  
0.0125 (0.32)  
0.0091 (0.23)  
–12–  
REV. A  

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