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AD5821A PDF预览

AD5821A

更新时间: 2024-02-13 01:09:29
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
16页 433K
描述
120 mA, Current Sinking, 10-Bit, I2C DAC

AD5821A 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Contact Manufacturer零件包装代码:DIE
包装说明:DIE,针数:0
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.78
Is Samacsys:N最大模拟输出电压:5.5 V
最小模拟输出电压:0.6 V转换器类型:D/A CONVERTER
输入位码:BINARY输入格式:SERIAL
JESD-30 代码:R-XUUC-N8最大线性误差 (EL):0.3906%
位数:10功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP认证状态:Not Qualified
标称安定时间 (tstl):250 µs标称供电电压:3.6 V
表面贴装:YES温度等级:INDUSTRIAL
端子形式:NO LEAD端子位置:UPPER
Base Number Matches:1

AD5821A 数据手册

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AD5821A  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Table 4.  
Parameter  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Rating  
VDD to AGND  
VDD to DGND  
AGND to DGND  
SCL, SDA to DGND  
XSHUTDOWN to DGND  
ISINK to AGND  
−0.3 V to +5.5 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to +0.3 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
Operating Temperature Range  
Industrial (B Version)  
Storage Temperature Range  
ESD CAUTION  
−30°C to +85°C  
−65°C to +150°C  
150°C  
Junction Temperature (TJ MAX  
WLCSP Power Dissipation  
θJA Thermal Impedance1  
)
(TJ MAX − TA)/θJA  
Mounted on 4-Layer Board  
Lead Temperature, Soldering  
Maximum Peak Reflow Temperature2  
95°C/W  
260°C ( 5°C)  
1 To achieve the optimum θJA, it is recommended that the AD5821A be  
soldered on a 4-layer board.  
2 As per JEDEC J-STD-020C.  
Rev. 0 | Page 5 of 16  
 
 

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