AD5592R
Data Sheet
2.000
1.960 SQ
1.920
3
2
1
4
A
B
C
D
BALL A1
IDENTIFIER
1.50
REF
0.50
BSC
TOP VIEW
(BALL SIDE DOWN)
BOTTOM VIEW
(BALL SIDE UP)
0.640
0.595
0.540
SIDE VIEW
COPLANARITY
0.05
0.340
0.320
0.300
SEATING
PLANE
0.270
0.240
0.210
Figure 52. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD5592RBCBZ-1-RL7
AD5592RBCPZ-1-RL7
AD5592RBRUZ
AD5592RBRUZ-RL7
AD5592RBCBZ-RL7
AD5592RBCPZ-RL7
EVAL-AD5592R-1SDZ
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Package Description
Package Option
Branding
16-Ball Wafer Level Chip Scale Package [WLCSP]
CB-16-3
CP-16-32
RU-16
RU-16
CB-16-3
CP-16-32
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Ball Wafer Level Chip Scale Package [WLCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board
DMD
DMG
1 Z = RoHS Compliant Part.
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D12506-0-2/17(C)
Rev. C | Page 42 of 42