AD5228
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD to GND
VA, VB, VW to GND
−0.3 V, +7 V
0 V, VDD
PU, PD, PRE Voltage to GND
Maximum Current
0 V, VDD
IWB, IWA Pulsed
IWB Continuous (RWB ≤ 5 kΩ, A open)1
IWA Continuous (RWA ≤ 5 kΩ, B open)1
20 mA
1 mA
1 mA
500 µA/ 100 µA/
50 µA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
IAB Continuous
(RAB = 10 kΩ/50 kΩ/100 kΩ)1
Operating Temperature Range
Maximum Junction Temperature
(TJmax)
Storage Temperature
Lead Temperature
−40°C to +105°C
150°C
−65°C to +150°C
245°C
(Soldering, 10 s – 30 s)
Thermal Resistance2 θJA
230°C/W
1 Maximum terminal current is bounded by the maximum applied voltage
across any two of the A, B, and W terminals at a given resistance, the
maximum current handling of the switches, and the maximum power
dissipation of the package. VDD = 5 V.
2 Package power dissipation = (TJmax – TA) / θJA.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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