LEAD MLCCS
技术要求
项目
测试方法和备注
Technical
Item
Test Method and Remarks
Specification
测试电压Measuring Voltage :
Ⅰ类:300%额定电压
ClassⅠ:300% Rated voltage
Ⅱ类:250%额定电压
ClassⅡ:250% Rated voltage
持续时间: 5±1 秒Duration: 5±1s
充/放电电流不应超过50mA
The charge/ discharge current is less than 50mA.
不应有介质被击
穿或损伤
端子与外装间Between terminals and body:
施加电压:2.5UR
耐电压
Withstandi-ng
Voltage
No breakdown or
damage.
持续时间:1~5s
Voltage: 2.5 times rated voltage
Duration:1~5s
金属制小球法 Small metallic ball method
将电容器本体插入盛满直径为1mm 的金属小球的容器中,但保留距端头处2mm 的本体不
插入。试验电压施加在短路回路端子和金属小球之间。
Small metallic balls with 1mm diameters shall be put in a vessel and the test capacitor
shall be submerged except 2mm from the top of its component body and the terminals.
The test voltage shall be applied between the short-circuited terminals and the metallic
balls.
上 锡 率 应 大 于
95%
将电容器引线浸入含有 25%松香的酒精溶液中 5-10 秒,然后浸入温度为: 245±5℃的金属
焊锡(Sn-3Ag-0.5Cu)中 2.5(+0.5,-0.5)秒,注意:电容器本体底面距离锡面约1.5~2mm。
The lead wire of capacitor is dipping into a 25% rosin solution of ethanol for 5s-10s and
then into molten solder(Sn-3Ag-0.5Cu )of 245±5℃ for 2.5(+0.5,-0.5)s. In both cases the
depth of dipping is up to about 1.5~2mm from the terminal body.
Lead wire shall
be at least 95%
可焊性
Solder ability
covered with
a
new
solder
coating.
锡温:260 ±5℃
时间:10±1 s
Solder temperature: 260 ±5℃
Duration: 10±1 s
ΔC/C:
浸入条件:将电容器插入厚度为1.6mm,孔径为1.0mm的PC板。
C0G: ≤ ±2.5%
或±.25pF
Immersed conditions: Inserted into the PC board (with t=1.6mm, hole=1.0mm diameter)
对于I类介质,试验后,应在标准条件下恢复24±2小时后才测试。
Recovery: For class I, 24±2 hours of recovery under the standard condition after test.
对于II类介质,在试验前应先进行如下预处理: 150(-10,+0) ℃,1小时,接着在标准
条件下恢复48 ±4 小时。
耐焊接热
Resistance to
Soldering
Heat
X7R:≤±12.5%
外观无可见损伤
No
significant
abnormality
appearance.
in
Preconditioning(Class II): 1 hour of preconditioning at 150(-10,+0) ℃, followed by 48
±4 hours of recovery under the standard condition.
恢复:对于II类介质试验后,应在标准条件下恢复48 ±4小时后才测试。
Recovery( Class II) : 48 ±4 hours of recovery under the standard condition after test.
6