Product specification
7
9
SERIES
0612/1020/1225
AC
Chip Resistor Surface Mount
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Solderability
- Wetting
Well tinned (≥95% covered)
AEC-Q200 Test 18
J-STD-002
Electrical Test not required Magnification 50X
SMD conditions:
No visible damage
(a) Method B, aging 4 hours at 155 °C dry heat,
dipping at 235±3 °C for 5±0.5 seconds.
(b) Method B, steam aging 8 hours, dipping at
215±3 °C for 5±0.5 seconds.
(c) Method D, steam aging 8 hours, dipping at
260±3 °C for 7±0.5 seconds.
Board Flex
AEC-Q200 Test 21
AEC-Q200-005
Chips mounted on a 90mm glass epoxy resin
PCB (FR4)
±(1.0%+0.05Ω)
<50 mΩ for Jumper
Bending for 0612 and above: 2 mm
Holding time: minimum 60 seconds
Temperature
Coefficient of
MIL-STD-202 Method 304
At +25/–55 °C and +25/+125 °C
Refer to table 2
Resistance (T.C.R.)
Formula:
R2–R1
T.C.R= ------------------------- ×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Short Time
Overload
IEC60115-1 4.13
ASTM-B-809-95
2.5 times of rated voltage or maximum
overload voltage whichever is less for
±(1.0%+0.05Ω) for D/F tol
±(2.0%+0.05Ω) for J tol
<50 mΩ for Jumper
1225 : 2s
0612/2010: 5s
at room temperature
FOS
±( 1.0%+0.05Ω)
Sulfur (saturated vapor) 500 hours, 60±2℃,
unpowered
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Dec. 11, 2015 V.1