AC.. Series
Cemented Wirewound Resistors
Vishay Draloric
BENDING FORMS
A
L
a
Ø D
I
b
WSZ
H
F
E
Solder pad dimensions
Ø d
TYPE
Ø d
Ø Dmax.
A
L
F
H
E
a
b
l
(1)
AC03 WSZ
0.8
17 0.5
11 - 12
4.8 0.5 3.6 0.5 5.0 0.5
2.5
5.5
14.5
Δh1
P2
P
Ø D
L
H1
1 max.
W2
d
RADIAL TAPED = RT
H
H0
t
L1
F
W1
P1
W0
W
P0
D0
Direction of Unreeling
TYPE AC01
Lead Ø
Ø d
Ø D
L
0.8
(1)
Diameter
(1)
Length
Pitch of components
Pitch of spocket holes (2)
P
12.7 1.0
12.7 0.3
3.85 0.7
6.35 1.0
P0
P1
P2
F
Distance between hole center and resistor center
Distance between hole center and lead center
Lead spacing
5.0 + 0.6, - 0.1
2 max.
Angle of insertion
Δh1
W
Width of carrier tape
18.0 0.5
12.0 0.5
9.0 0.5
0.5 max.
19.5 1.0
16.0 0.5
4.0 0.2
0.9 max.
11 max.
Width of adhesive tape
Position of holes
W0
W1
W2
H
Position of adhesive tape
Body to hole center
Lead crimp to hole center (3)
H0
D0
t
Hole Ø
Thickness of tape (4)
Height for cutting
L1
Height for insertion
H1
32 max.
Notes
(1) See table DIMENSIONS
(2) Test over 10 holes - 9 intervals P0 12.7 x 9 = 114.3 0.5
(3) Parallelism, < 0.5 mm
(4) Thickness of carrier tape: 0.55 mm 0.1
Document Number: 28730
Revision: 27-Oct-09
For technical questions, contact: ww1resistors@vishay.com
www.vishay.com
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