CHIP RESISTOR
标 准
Specifications
项目
Item
测试方法
Test Methods
无可见损伤
No mechanical damage
高温存储
High
Temperature
Exposure
(Storage)
AEC-Q200 Test 3 /MIL-STD-202 Method 108
1000小时 @ T=155℃,不通电。
1000 hrs. @ T=155℃. Unpowered.
0.5%
、1%:
△R
≤±(1.0%R
+
0.05
0.05
Ω
)
)
5%:
△R≤±(2.0%R
+
Ω
AEC-Q200 Test 4/JESD22 Method JA-104
预处理:2次回流焊
无可见损伤
No mechanical damage
温度循环
Temperature
Cycling
Pretreatment: two times reflow soldering.
-55℃(30分钟)~常温(≤1分钟)~155℃(30分钟),1000个循环。
-55℃(30min)~normal temperature(≤1min)~
155℃(30min),1000 cycles.
0.5% 1%:
、
△R≤±(0.5%R
+
0.05
0.05
Ω
)
)
5%:
△R≤±(1.0%R
+
Ω
AEC-Q200 Test 7/ MIL-STD-202 Method 103
预处理:2次回流焊
Pretreatment: two times reflow soldering.
温度85℃,湿度85%的条件下施加10%额定功率(电流)下的电压值或
元件极限电压(取最小值),放置1000小时,通1.5小时/断0.5小时。
无可见损伤
No mechanical damage
≤±(3.0%R 0.05
高温高湿
Biased Humidity
△R
+
Ω)
℃
85 /85%RH,apply 10% of operating power(current) or
limiting element voltage for 1000 hours,1.5hour on, 0.5
hour off.
AEC-Q200 Test 8/ MIL-STD-202 Method 108
预处理:2次回流焊
Pretreatment: two times reflow soldering.
无可见损伤
No mechanical damage
0.5% 1%:
、
工作寿命
Operational Life
125℃±2℃,1000小时,36%额定功率(电流)下的电压值或元件极
△
5%
R
:
≤±(1.0%R
+
0.05
Ω
)
)
限电压(取最小值)
,通1.5小时/断0.5小时。
△R≤±(3.0%R
+0.05
Ω
125℃±2℃,1000h,36% of operating power or limiting element
voltage whichever is lower for 1.5h ON/0.5h OFF.
AEC-Q200 Test 12/ MIL-STD-202 Method 215
浸在三种溶剂3min后擦拭10次,浸、刷共3回,用水洗清洗剂进行
清洗,并且室温下对整个表面进行通风干燥。
Immersed in three solvents after 3min immersion, brush wipe
10 times, a total of 3 times, washing with washing and cleaning
agent, room temperature on the surface of the ventilation drying.
耐溶剂性
Resistance to
Solvents
标志清晰,无可见损伤
Clearly marked,
No mechanical damage
AEC-Q200 Test 13/ MIL-STD-202 Method 213
正半弦波,峰值加速度:100
次,共18次。
Positive half wave, peak acceleration: 100
duration: 6ms, three axis six to each 3 times, a total of
18 times.
g′s,脉冲持续时间:6ms,三轴六向
机械冲击
Mechanical
Shock
无可见损伤
No mechanical damage
△R≤±(1.0%R+0.05Ω)
各
3
g′s
, pulse
AEC-Q200 Test 14/ MIL-STD-202 Method 204
预处理:
Pretreatment: two times reflow soldering.
频率:10Hz~2000Hz,加速度:5 g s,一个循环20min
三个方向每个方向12个循环,共36个循环。
Frequency: 10Hz ~ 2000Hz, acceleration: 5 g
2次回流焊
无可见损伤
No mechanical damage
≤±(1.0%R 0.05
振动
Vibration
′
,X、Y、
△R
+
Ω)
Z
′
s, a loop
20min, X, Y, Z three directions, each direction 12 cycles,
36 cycles.
无可见损伤
No mechanical damage
0.5% 1%
AEC-Q200 Test 15/ MIL-STD-202 Method 210
270℃±5℃锡槽,保持10s±1s。
Lead-free solder bath at 270℃±5℃ for 10s±1s.
耐焊接热
Resistance to
Soldering Heat
、
:
△R
≤±(0.5%R
+
0.05Ω
)
5%:
△R≤±(1.0%R
+
0.05Ω
)
无可见损伤
No mechanical damage
0.5% 1%
AEC-Q200 Test 16/MIL-STD-202 Method 107
≤ 秒)~155℃(15分钟),300个循环。
-55℃(15分钟)~常温( 20
-55℃(15min)~normal temperature(≤20s)~155℃(15min) ,
300 cycles.
热冲击
Thermal Shock
、
:
△R
≤±(0.5%R
+
0.05Ω
)
5%:
△R≤±(1.0%R
+
0.05Ω
)
5