8283
LNB SUPPLY AND
CONTROL-VOLTAGE REGULATOR
FUNCTIONAL DESCRIPTION (cont’d)
This can be accomplished by connecting a 200 kΩ
resistor from the external modulation terminal (24) to
ground. This will reduce the LNB output voltage by
typically 300 mV without effecting the VBULK voltage.
The output voltage can be restored to the programmed
value by connecting a 1 MΩ resistor from the VINT
terminal (23) to the TCAP terminal (12). This raises both
VBULK and VO by typically 300 mV.
Two terminals are dedicated to the over-current
protection/monitoring: SENSE and OLF. The LNB output
is current limited. The short-circuit protection threshold is
set by the value of an external resistor, RS, between
terminals 3 and 8. RS = VOM(th)/IOM where VOM(th) is the
current-limiting threshold voltage and IOM is the desired
current limit value. The minimum recommended value
for RS is 0.15 Ω.
The output linear regulator will sink and source
current. This feature allows full modulation capability
into capacitive loads as high as 0.25 µF.
In operation, the short-circuit protection produces
current fold-back at the input due to the tracking con-
verter. If the output is shorted, the linear regulator will
limit the output current to IOM. The tracking converter
will maintain a constant voltage drop of 0.8 V across the
linear regulator. This condition results in typically
550 mW dissipation (IOM x 0.8 V). Short-circuit or
thermal-shutdown activation will cause the OLF terminal,
an open-drain diagnostic output flag, to go LOW.
The programmed output voltage rise and fall times
can be set by an internal 25 kΩ resistor and an external
capacitor located on the TCAP terminal. Although any
value of capacitor is permitted, practical values are
typically 0.001 µF to 0.02 µF. This feature only affects
the turn on and programmed voltage rise and fall times.
Modulation is unaffected by the choice of TCAP. This
terminal can be left open if voltage rise and fall time
control is not required.
Thermal resistance:
DIP
SOIC —
—
R
R
θJA = 40°C/W, RθJT = 6°C/W, or
θJA = 55°C/W, RθJT = 6°C/W.
The device junction temperature should be kept below
150°C. Thermal shut-down circuitry turns off the device
if junction temperature exceeds +165°C typically.
The products described here are manufactured under one or more
U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to
time, such departures from the detail specifications as may be
required to permit improvements in the performance, reliability, or
manufacturability of its products. Before placing an order, the user is
cautioned to verify that the information being relied upon is current.
Allegro products are not authorized for use as critical components
in life-support devices or systems without express written approval.
The information included herein is believed to be accurate and
reliable. However, Allegro MicroSystems, Inc. assumes no responsi-
bility for its use; nor for any infringement of patents or other rights of
third parties which may result from its use.
www.allegromicro.com
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