Datasheet > A43L8316V-7

A43L8316V-7

更新时间： 2022-12-11 20:54:34

品牌	Logo	应用领域
联笙电子 - AMICC		动态存储器
页数	文件大小	规格书
45页	1382K
描述
128K X 16 Bit X 2 Banks Synchronous DRAM

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数据手册

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A43L8316V-7 数据手册

A43L8316

Absolute Maximum Ratings*

*Comments

Voltage on any pin relative to VSS (Vin, Vout ) . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +4.6V

Voltage on VDD supply relative to VSS (VDD, VDDQ )

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-1.0V to +4.6V

Storage Temperature (TSTG) . . . . . . . . . . -55°C to +150°C

Soldering Temperature X Time (TSLODER) . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C X 10sec

Power Dissipation (PD) . . . . . . . . . . . . . . . . . . . . . . . . .1W

Short Circuit Current (Ios) . . . . . . . . . . . . . . . . . . . . 50mA

Permanent device damage may occur if “Absolute

Maximum Ratings” are exceeded.

Functional operation should be restricted to recommended

operating condition.

Exposure to higher than recommended voltage for

extended periods of time could affect device reliability.

DC Electrical Characteristics

Recommend operating conditions (Voltage referenced to VSS = 0V)

Parameter

Supply Voltage

Symbol

Min

3.0

2.0

-0.3

2.4

Typ

Max

Unit

Note

VDD,VDDQ

3.3

3.6

Input High Voltage

VIH

VIL

VOH

VOL

IIL

3.0

VDD+0.3

Input Low Voltage

0.8

Note 1

IOH = -2mA

IOL = 2mA

Note 2

Output High Voltage

Output Low Voltage

Input Leakage Current

Output Leakage Current

Output Loading Condition

0.4

-5

IOL

-5

Note 3

See Figure 1

Note: 1. VIL (min) = -1.5V AC (pulse width £ 5ns).

2. Any input 0V £ VIN £ VDD + 0.3V, all other pins are not under test = 0V

3. Dout is disabled, 0V £ Vout £ VDD

Decoupling Capacitance Guide Line

Recommended decoupling capacitance added to power line at board.

Parameter

Symbol

CDC1

Value

Unit

Decoupling Capacitance between VDD and VSS

Decoupling Capacitance between VDDQ and VSSQ

0.1 + 0.01

CDC2

Note: 1. VDD and VDDQ pins are separated each other.

All VDD pins are connected in chip. All VDDQ pins are connected in chip.

2. VSS and VSSQ pins are separated each other

All VSS pins are connected in chip. All VSSQ pins are connected in chip.

Preliminary (April, 2000, Version 1.0)

AMIC Technology, Inc.

1 2 3 456 7 8...45

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