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A43L3616AG-75UF PDF预览

A43L3616AG-75UF

更新时间: 2024-01-03 10:21:24
品牌 Logo 应用领域
联笙电子 - AMICC 动态存储器内存集成电路
页数 文件大小 规格书
41页 629K
描述
DRAM

A43L3616AG-75UF 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:VFBGA,Reach Compliance Code:unknown
风险等级:5.75访问模式:FOUR BANK PAGE BURST
最长访问时间:5.4 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:S-PBGA-B54长度:8 mm
内存密度:134217728 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:54
字数:8388608 words字数代码:8000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:SQUARE封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:1 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:8 mm
Base Number Matches:1

A43L3616AG-75UF 数据手册

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A43L3616A Series  
2M x 16 Bit x 4 Banks Synchronous DRAM  
Preliminary  
Features  
„ JEDEC standard 3.3V ± 0.3V power supply  
„ LVTTL compatible with multiplexed address  
„ Industrial operating range: -40°C to +85°C for –U  
„ Automotive temperature operation:-40°C to +85°C for -A  
„ Burst Read Single-bit Write operation  
„ DQM for masking  
„ Auto & self refresh  
„ 64ms refresh period (4K cycle)  
„ Available in 54 Balls CSP (8mm X 8mm) and 54-pin  
TSOP(II) packages  
„ Package is available to lead free (-F series)  
„ All Pb-free (Lead-free) products are RoHS compliant  
„ Four banks / Pulse RAS  
„ MRS cycle with address key programs  
- CAS Latency (2,3)  
- Burst Length (1,2,4,8)  
- Burst Type (Sequential & Interleave)  
„ All inputs are sampled at the positive going edge of the  
system clock  
General Description  
The A43L3616A is 134,217,728 bits synchronous high data  
rate Dynamic RAM organized as 4 X 2,097,152 words by 16  
bits, abricated with AMIC’s high performance CMOS  
technology. Synchronous design allows precise cycle control  
with the use of system clock. I/O transactions are possible on  
every clock cycle. Range of operating frequencies,  
programmable latencies allow the same device to be useful  
for a variety of high bandwidth, high performance memory  
system applications.  
Pin Configuration  
„ 54 Balls CSP (8 mm x 8 mm)  
Top View  
54 Ball (6X9) CSP  
1
2
3
7
8
9
A
B
C
D
E
F
VSS  
DQ15  
DQ13  
DQ11  
DQ9  
NC  
VSSQ  
VDDQ  
VSSQ  
VDDQ  
VSS  
VDDQ  
VSSQ  
VDDQ  
VSSQ  
VDD  
DQ0  
DQ2  
DQ4  
DQ6  
LDQM  
VDD  
DQ1  
DQ3  
DQ5  
DQ7  
DQ14  
DQ12  
DQ10  
DQ8  
UDQM  
CLK  
CKE  
CAS  
BA0  
RAS  
BA1  
WE  
G
NC  
A11  
A9  
CS  
A10  
VDD  
H
J
A8  
A7  
A5  
A6  
A4  
A0  
A3  
A1  
A2  
VSS  
PRELIMINARY (November, 2011, Version 0.8)  
1
AMIC Technology, Corp.