A43E06161
Decoupling Capacitance Guide Line
Recommended decoupling capacitance added to power line at board.
Parameter
Symbol
Value
Unit
µF
Decoupling Capacitance between VDD and VSS
Decoupling Capacitance between VDDQ and VSSQ
CDC1
CDC2
0.1 + 0.01
0.1 + 0.01
µF
Note: 1. VDD and VDDQ pins are separated each other.
All VDD pins are connected in chip. All VDDQ pins are connected in chip.
2. VSS and VSSQ pins are separated each other
All VSS pins are connected in chip. All VSSQ pins are connected in chip.
DC Electrical Characteristics
(Recommended operating condition unless otherwise noted, TA = 0 to 70°C or -40ºC to +85ºC)
Speed
CAS
Symbol
Parameter
Test Conditions
Unit Notes
Latency
-75
-95
Operating Current
(One Bank Active)
Burst Length = 1
Icc1
20
mA
mA
1
tRC ≥ tRC(min), tCC ≥ tCC(min), IOL = 0mA
Icc2 P
Precharge Standby
Current in power-
down mode
CKE ≤ VIL(max), tCC = 15ns
0.3
0.1
Icc2 PS
CKL ≤ VIL(max), tCC = ∞
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 15ns
ICC2N
Precharge Standby
Current in non
power-down mode
5
2
Input signals are changed one time during 30ns
mA
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable.
ICC2NS
ICC3 P
Active Standby
Current in power-
down mode
mA
mA
2
CKE ≤ VIL(max), tCC = 15ns
Active Standby
current in non
power-down mode
(One Bank Active)
CKE ≥ VIH(min), CS ≥ VIH(min), tCC = 15ns
Input signals are changed one time during 30ns
10
ICC3N
ICC4
Operating Current
(Burst Mode)
IOL = 0mA, Page Burst
All bank Activated, tCCD = tCCD (min)
20
mA
1
2
ICC5
ICC6
Refresh Current
20
mA
tRC ≥ tRC (min)
CKE ≤ 0.2V
Self Refresh
Current
200
µA
Deep Power Down
Current
ICC7
CKE ≤ 0.2V
10
µA
Note: 1. Measured with outputs open. Addresses are changed only one time during tCC(min).
2. Refresh period is 32ms. Addresses are changed only one time during tCC(min).
PRELIMINARY (July, 2005, Version 0.1)
5
AMIC Technology, Corp.