D A T A S H E E T
REVISION SUMMARY
Distinctive Characteristics
Revision A (August 14, 2002)
Initial Release.
Updated Automatic Sleep Mode and standby mode current
values.
Revision A+1 (August 28, 2002)
Sector Protection/Unprotection
Pin Configuration
Updated VCC low-end value.
Ordering Information
Changed beginning of second paragraph from, “The primary
method....” to read, “Sector protection/unprotection.”
Deleted third paragraph.
Changed WB package type to WA.
DC Characteristics, CMOS Compatible
FBB048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
6 x 8 mm package
Updated VCC Standby and Reset currents Typ values, and
Automatic Sleep Mode Typ value.
Changed number in row D in table from 9.00 mm to 8.0 mm.
Revision A+2 (February 5, 2003)
Global
Revision A+4 (March 18, 2003)
Ordering Information, Valid Combinations
Removed dashes from Order Numbers.
Changed fastest speed option from 103 ns to 100 ns, regu-
lated voltage, added 110 ns speed option standard voltage.
Revision A+5 (March 3, 2005)
General Description
Ordering Information
Changed first sentenced to indicate 48-pin TSOP package
option.
Added Commercial and Industrial Pb-free Package tempera-
tures.
Command Definitions, Table 5
Valid Combinations for TSOP package
Added two package codes.
Removed TBD markers from device ID, Top Boot Block to
70h.
Removed TBD markers from device ID, Bottom Boot Block to
FIh.
Valid Combination for FBGA package
Added two package codes.
Changed address bits A18–A11 to A17–A11.
Physical Dimensions, 48-pin TSOP
Global
Added Colophon. Updated Trademark information.
Changed from Reverse to Standard TSOP package.
Revision A6 (January 23, 2007)
AC Characteristics
Revision A+3 (February 26, 2003)
Global
Erase and Program Operations table: Changed tBUSY to a
maximum specification.
Added 110 ns speed option.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 2002–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright © 2006–2007 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations
thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
42
Am29SL400C
Am29SL400C_00_A6 January 23, 2007
5秒后页面跳转
一文带你解读74HC244资料手册：特性、应用场景、封装方式、引脚配置说明、电气参数、推荐替代型号
AD623资料手册解读：特性、应用、封装、引脚功能及电气参数
RT9193资料手册解读：RT9193引脚功能、电气参数、替换型号推荐
VIPER22A的资料手册解读、引脚参数说明、代换型号推荐
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
