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A3995SEVTR-T PDF预览

A3995SEVTR-T

更新时间: 2024-01-03 04:20:27
品牌 Logo 应用领域
急速微 - ALLEGRO 驱动器运动控制电子器件信号电路电动机控制电机
页数 文件大小 规格书
9页 943K
描述
DMOS Dual Full Bridge PWM Motor Driver

A3995SEVTR-T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:QFN-36针数:36
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:8.56
Is Samacsys:N其他特性:ALSO REQUIRES 8V TO 36V VBB SUPPLY
模拟集成电路 - 其他类型:STEPPER MOTOR CONTROLLERJESD-30 代码:S-XQCC-N36
JESD-609代码:e3长度:6 mm
湿度敏感等级:2功能数量:2
端子数量:36最高工作温度:85 °C
最低工作温度:-20 °C最大输出电流:3.5 A
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC36,.25SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3/5,36 V认证状态:Not Qualified
座面最大高度:1 mm子类别:Motion Control Electronics
最大供电电流 (Isup):10 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):3 V表面贴装:YES
技术:NMOS温度等级:OTHER
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6 mm
Base Number Matches:1

A3995SEVTR-T 数据手册

 浏览型号A3995SEVTR-T的Datasheet PDF文件第3页浏览型号A3995SEVTR-T的Datasheet PDF文件第4页浏览型号A3995SEVTR-T的Datasheet PDF文件第5页浏览型号A3995SEVTR-T的Datasheet PDF文件第6页浏览型号A3995SEVTR-T的Datasheet PDF文件第7页浏览型号A3995SEVTR-T的Datasheet PDF文件第8页 
A3995  
DMOS Dual Full Bridge PWM Motor Driver  
EV Package, 36 Pin QFN with Exposed Thermal Pad  
6.15 .242  
5.85 .230  
A
Preliminary dimensions, for reference only  
(reference JEDEC MO-220VJJD-1, except exposed thermal pad)  
Dimensions in millimeters  
U.S. Customary dimensions (in.) in brackets, for reference only  
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions  
Exact case and lead configuration at supplier discretion within limits shown  
B
36  
1
2
A
A
B
Terminal #1 mark area  
6.15 .242  
5.85 .230  
Exposed thermal pad (reference only, terminal #1  
identifier appearance at supplier discretion)  
C
Reference land pattern layout (reference IPC7351  
QFN50P600X600X100-37V1M); adjust as necessary to  
meet application process requirements and PCB layout  
tolerances; when mounting on a multilayer PCB, thermal  
vias at the exposed thermal pad land can improve thermal  
dissipation (reference EIA/JEDEC Standard JESD51-5)  
C
36X  
SEATING  
PLANE  
0.08 [.003]  
C
0.30 .012  
0.18 .007  
36X  
1.00 .039  
0.80 .031  
0.10 [.004] M  
0.05 [.002] M  
C
C
A B  
0.20 .008  
REF  
0.25 .010  
0.50 .020  
32X0.20 .008  
NOM  
0.05 .002  
0.00 .000  
MIN  
0.50 .020  
1.15 .045  
NOM  
0.75 .030  
0.35 .014  
36  
NOM  
1
2
5.8 .228  
NOM  
C
.163  
4.15  
NOM  
4X0.20 .008  
MIN  
R0.30 .012  
REF  
.163  
4.15  
NOM  
2
1
4X0.20 .008  
MIN  
36  
.163  
4.15  
NOM  
.163  
4.15  
NOM  
5.8 .228  
NOM  
The products described here are manufactured under one or more U.S. patents or U.S. patents pending.  
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to  
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that  
the information being relied upon is current.  
Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its  
use; nor for any infringement of patents or other rights of third parties which may result from its use.  
Copyright© 2006 AllegroMicrosystems, Inc.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff, Box 15036  
9
Worcester, Massachusetts 01615-0036 (508) 853-5000  
www.allegromicro.com  

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