是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | LBGA, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.76 |
Is Samacsys: | N | JESD-30 代码: | S-PBGA-B256 |
JESD-609代码: | e1 | 长度: | 17 mm |
湿度敏感等级: | 3 | 可配置逻辑块数量: | 1536 |
等效关口数量: | 60000 | 端子数量: | 256 |
组织: | 1536 CLBS, 60000 GATES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE | 峰值回流温度(摄氏度): | 250 |
可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY | 座面最大高度: | 1.7 mm |
最大供电电压: | 1.575 V | 最小供电电压: | 1.425 V |
标称供电电压: | 1.5 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 17 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F060M3A-FGG256YM | MICROSEMI |
获取价格 |
Field Programmable Gate Array, |
![]() |
A2F060M3A-FGG288 | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG288ES | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG288I | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG288Y | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG288YES | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG288YI | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG484 | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG484ES | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |
A2F060M3A-FGG484I | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |
![]() |