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A29L161ATG-60IF PDF预览

A29L161ATG-60IF

更新时间: 2022-12-01 22:48:15
品牌 Logo 应用领域
联笙电子 - AMICC /
页数 文件大小 规格书
32页 444K
描述
Flash, 1MX16, 60ns, PBGA48, 6 X 8 MM, ROHS COMPLIANT, TFBGA-48

A29L161ATG-60IF 数据手册

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A29L161A Series  
ICC2 in the DC Characteristics table represents the active  
current specification for the write mode. The "AC  
Characteristics" section contains timing specification tables  
and timing diagrams for write operations.  
Requirements for Reading Array Data  
To read array data from the outputs, the system must drive  
the  
and  
pins to VIL.  
is the power control and  
CE  
OE  
CE  
selects the device.  
is the output control and gates array  
OE  
data to the output pins.  
Program and Erase Operation Status  
should remain at VIH all the time  
WE  
During an erase or program operation, the system may  
check the status of the operation by reading the status bits  
on I/O7 - I/O0. Standard read cycle timings and ICC read  
specifications apply. Refer to "Write Operation Status" for  
more information, and to each AC Characteristics section for  
timing diagrams.  
during read operation. The internal state machine is set for  
reading array data upon device power-up, or after a  
hardware reset. This ensures that no spurious alteration of  
the memory content occurs during the power transition. No  
command is necessary in this mode to obtain array data.  
Standard microprocessor read cycles that assert valid  
addresses on the device address inputs produce valid data  
on the device data outputs. The device remains enabled for  
read access until the command register contents are altered.  
See "Reading Array Data" for more information. Refer to the  
AC Read Operations table for timing specifications and to the  
Read Operations Timings diagram for the timing waveforms,  
lCC1 in the DC Characteristics table represents the active  
current specification for reading array data.  
Standby Mode  
When the system is not reading or writing to the device, it  
can place the device in the standby mode. In this mode,  
current consumption is greatly reduced, and the outputs are  
placed in the high impedance state, independent of the  
input.  
OE  
The device enters the CMOS standby mode when the  
CE  
pin is both held at VCC ± 0.3V. (Note that this is a more  
restricted voltage range than VIH.) If are held at VIH, but  
not within VCC ± 0.3V, the device will be in the standby  
mode, but the standby current will be greater. The device  
requires the standard access time (tCE) before it is ready to  
read data.  
Writing Commands/Command Sequences  
CE  
To write a command or command sequence (which includes  
programming data to the device and erasing sectors of  
memory), the system must drive  
and  
to VIL, and  
CE  
WE  
to VIH. The device features an Unlock Bypass mode to  
OE  
facilitate faster programming. Once the device enters the  
Unlock Bypass mode, only two write cycles are required to  
program a word or byte, instead of four. The “  
If the device is deselected during erasure or programming,  
the device draws active current until the operation is  
completed.  
ICC3 in the DC Characteristics tables represent the standby  
current specification.  
Program Command Sequence” section has details on  
programming data to the device using both standard and  
Unlock Bypass command sequence. An erase operation can  
erase one sector, multiple sectors, or the entire device. The  
Sector Address Tables indicate the address range that each  
sector occupies. A "sector address" consists of the address  
inputs required to uniquely select a sector. See the  
"Command Definitions" section for details on erasing a sector  
or the entire chip, or suspending/resuming the erase  
operation.  
After the system writes the autoselect command sequence,  
the device enters the autoselect mode. The system can then  
read autoselect codes from the internal register (which is  
separate from the memory array) on I/O7 - I/O0. Standard  
read cycle timings apply in this mode. Refer to the  
"Autoselect Mode" and "Autoselect Command Sequence"  
sections for more information.  
Automatic Sleep Mode  
The automatic sleep mode minimizes Flash device energy  
consumption. The device automatically enables this mode  
when addresses remain stable for tACC +30ns. The automatic  
sleep mode is independent of the  
,
and  
control  
OE  
WE  
CE  
signals. Standard address access timings provide new data  
when addresses are changed. While in sleep mode, output  
data is latched and always available to the system.  
Output Disable Mode  
When the  
input is at VIH, output from the device is  
OE  
disabled. The output pins are placed in the high impedance  
state.  
PRELIMINARY (March, 2006, Version 0.0)  
5
AMIC Technology, Corp.  

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