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A29800UV-90IF PDF预览

A29800UV-90IF

更新时间: 2024-01-07 09:32:10
品牌 Logo 应用领域
联笙电子 - AMICC 光电二极管内存集成电路
页数 文件大小 规格书
37页 572K
描述
Flash, 512KX16, 90ns, PDSO48, ROHS COMPLIANT, TSOP1-48

A29800UV-90IF 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
零件包装代码:TSOP1包装说明:TSOP1, TSSOP48,.8,20
针数:48Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.68最长访问时间:90 ns
其他特性:BOTTOM BOOT SECTOR备用内存宽度:8
启动块:BOTTOM命令用户界面:YES
数据轮询:YES耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G48长度:18.4 mm
内存密度:8388608 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:1,2,1,15端子数量:48
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
编程电压:5 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:16K,8K,32K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.04 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:YES类型:NOR TYPE
宽度:12 mm

A29800UV-90IF 数据手册

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A29800 Series  
Word/Byte Configuration  
Program and Erase Operation Status  
During an erase or program operation, the system may check  
the status of the operation by reading the status bits on I/O7 -  
I/O0. Standard read cycle timings and ICC read specifications  
apply. Refer to "Write Operation Status" for more information,  
and to each AC Characteristics section for timing diagrams.  
The  
pin determines whether the I/O pins I/O15 - I/O0  
BYTE  
operate in the byte or word configuration. If the  
pin is  
BYTE  
set at logic “1”, the device is in word configuration, I/O15 - I/O0  
are active and controlled by and  
.
OE  
CE  
If the  
pin is set at logic “0”, the device is in byte  
BYTE  
configuration, and only I/O0 - I/O7 are active and controlled by  
and . I/O8- I/O14 are tri-stated, and I/O15 pin is used as  
Standby Mode  
When the system is not reading or writing to the device, it can  
place the device in the standby mode. In this mode, current  
consumption is greatly reduced, and the outputs are placed in  
CE  
OE  
an input for the LSB(A-1) address function.  
Requirements for Reading Array Data  
the high impedance state, independent of the  
input.  
OE  
To read array data from the outputs, the system must drive  
The device enters the CMOS standby mode when the  
&
CE  
the  
and  
pins to VIL.  
is the power control and  
CE  
OE  
CE  
pins are both held at VCC ± 0.5V. (Note that this is a  
RESET  
more restricted voltage range than VIH.) The device enters the  
TTL standby mode when is held at VIH, while is  
selects the device.  
OE  
data to the output pins.  
is the output control and gates array  
CE  
RESET  
should remain at VIH all the time  
WE  
held at VCC±0.5V. The device requires the standard access  
time (tCE) before it is ready to read data.  
during read operation. The internal state machine is set for  
reading array data upon device power-up, or after a hardware  
reset. This ensures that no spurious alteration of the memory  
content occurs during the power transition. No command is  
necessary in this mode to obtain array data. Standard  
microprocessor read cycles that assert valid addresses on the  
device address inputs produce valid data on the device data  
outputs. The device remains enabled for read access until the  
command register contents are altered.  
If the device is deselected during erasure or programming,  
the device draws active current until the operation is  
completed.  
ICC3 in the DC Characteristics tables represents the standby  
current specification.  
Output Disable Mode  
See "Reading Array Data" for more information. Refer to the  
AC Read Operations table for timing specifications and to the  
Read Operations Timings diagram for the timing waveforms,  
lCC1 in the DC Characteristics table represents the active  
current specification for reading array data.  
When the  
input is at VIH, output from the device is  
OE  
disabled. The output pins are placed in the high impedance  
state.  
: Hardware Reset Pin  
RESET  
Writing Commands/Command Sequences  
The  
pin provides a hardware method of resetting the  
RESET  
device to reading array data. When the system drives the  
pin low for at least a period of tRP, the device  
To write a command or command sequence (which includes  
programming data to the device and erasing sectors of  
RESET  
memory), the system must drive  
and  
to VIL, and  
CE  
immediately terminates any operation in progress, tristates all  
data output pins, and ignores all read/write attempts for the  
WE  
to VIH. An erase operation can erase one sector, multiple  
OE  
duration of the  
pulse. The device also resets the  
RESET  
sectors, or the entire device. The Sector Address Tables  
indicate the address range that each sector occupies. A  
"sector address" consists of the address inputs required to  
uniquely select a sector. See the "Command Definitions"  
section for details on erasing a sector or the entire chip, or  
suspending/resuming the erase operation.  
internal state machine to reading array data. The operation  
that was interrupted should be reinitiated once the device is  
ready to accept another command sequence, to ensure data  
integrity.  
The  
pin may be tied to the system reset circuitry. A  
RESET  
After the system writes the autoselect command sequence,  
the device enters the autoselect mode. The system can then  
read autoselect codes from the internal register (which is  
separate from the memory array) on I/O7 - I/O0. Standard read  
cycle timings apply in this mode. Refer to the "Autoselect  
Mode" and "Autoselect Command Sequence" sections for  
more information.  
system reset would thus also reset the Flash memory,  
enabling the system to read the boot-up firmware from the  
Flash memory.  
Refer to the AC Characteristics tables for  
and diagram.  
parameters  
RESET  
ICC2 in the DC Characteristics table represents the active  
current specification for the write mode. The "AC  
Characteristics" section contains timing specification tables  
and timing diagrams for write operations.  
(October, 2011, Version 1.9)  
5
AMIC Technology, Corp.  

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