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A1440A-2PGG175C PDF预览

A1440A-2PGG175C

更新时间: 2024-01-11 06:16:43
品牌 Logo 应用领域
美高森美 - MICROSEMI 时钟现场可编程门阵列可编程逻辑
页数 文件大小 规格书
90页 4491K
描述
Field Programmable Gate Array, 564 CLBs, 4000 Gates, 200MHz, CMOS, CPGA175, ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, PGA-175

A1440A-2PGG175C 技术参数

生命周期:Obsolete包装说明:ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, PGA-175
Reach Compliance Code:unknown风险等级:5.82
最大时钟频率:200 MHzCLB-Max的组合延迟:2.3 ns
JESD-30 代码:S-CPGA-P175长度:39.878 mm
可配置逻辑块数量:564等效关口数量:4000
端子数量:175最高工作温度:70 °C
最低工作温度:组织:564 CLBS, 4000 GATES
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:HPGA
封装形状:SQUARE封装形式:GRID ARRAY, HEAT SINK/SLUG
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY座面最大高度:7.874 mm
最大供电电压:5.25 V最小供电电压:4.75 V
标称供电电压:5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:PIN/PEG端子节距:2.54 mm
端子位置:PERPENDICULAR宽度:39.878 mm

A1440A-2PGG175C 数据手册

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Accelerator Series FPGAs – ACT 3 Family  
Ordering Information  
_
RQ  
G
208  
A
1
A14100  
C
Application (Temperature Range)  
C = Commercial (0 to +70°C)  
I = Industrial (–40 to +85°C)  
M = Military (–55 to +125°C)  
B = MIL-STD-883  
Package Lead Count  
Lead-Free Packaging  
Blank = Standard Packaging  
G = RoHS Compliant Packaging  
Package Type  
PG = Ceramic Pin Grid Array  
PL = Plastic Leaded Chip Carrier  
PQ = Plastic Quad Flatpack  
RQ = Plastic Power Quad Flatpack  
VQ = Very Thin (1.0 mm) Quad Flatpack  
TQ = Thin (1.4 mm) Quad Flatpack  
CQ = Ceramic Quad Flatpack  
BG = Plastic Ball Grid Array  
Speed Grade  
Std = Standard Speed  
–1 = Approximately 15% faster than Standard  
–2 = Approximately 25% faster than Standard  
–3 = Approximately 35% faster than Standard  
Die Revision  
A = 1.0 mm CMOS Process  
Part Number  
A1415A = 1,500 Gates  
A14V15A = 1,500 Gates (3.3 V)  
A1425A = 2,500 Gates  
A14V25A = 2,500 Gates (3.3 V)  
A1440A = 4,000 Gates  
A14V40A = 4,000 Gates (3.3 V)  
A1460A = 6,000 Gates  
A14V60A = 6,000 Gates (3.3 V)  
A14100A = 10,000 Gates  
A14V100A = 10,000 Gates (3.3 V)  
Notes:  
1. The –2 and –3 speed grades have been discontinued.  
2. The Ceramic Pin Grid Array packages PG100, PG133, and PG175 have been discontinued in all device densities, speed  
grades, and temperature grades.  
3. The Plastic Ball Grid Array package BG225 has been discontinued in all device densities (specifically for A1460A), all speed  
grades, and all temperature grades.  
4. Military Grade devices are no longer available for the A1440A device.  
5. For more information about discontinued devices, refer to the Product Discontinuation Notices (PDNs) listed below, available on  
the Microsemi SoC Products Group website:  
PDN March 2001  
PDN 0104  
PDN 0203  
PDN 0604  
PDN 1004  
II  
Revision 3  

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