Datasheet > 可编程逻辑 > 现场可编程门阵列> A1425A-3PQG100C

A1425A-3PQG100C

更新时间： 2024-01-29 20:16:08

品牌	Logo	应用领域
美高森美 - MICROSEMI		现场可编程门阵列可编程逻辑
页数	文件大小	规格书
90页	4491K
描述
FPGA, 310 CLBS, 2500 GATES, 250 MHz, PQFP100, ROHS COMPLIANT, PLASTIC, QFP-100

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A1425A-3PQG100C 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	PLASTIC, BGA-313	Reach Compliance Code：	compliant
风险等级：	5.83	其他特性：	MAX 228 I/OS
最大时钟频率：	100 MHz	CLB-Max的组合延迟：	3 ns
JESD-30 代码：	S-PBGA-B313	JESD-609代码：	e1
长度：	35 mm	湿度敏感等级：	3
可配置逻辑块数量：	1377	等效关口数量：	10000
端子数量：	313	最高工作温度：	70 °C
最低工作温度：		组织：	1377 CLBS, 10000 GATES
封装主体材料：	PLASTIC/EPOXY	封装代码：	IBGA
封装形状：	SQUARE	封装形式：	GRID ARRAY, INTERSTITIAL PITCH
峰值回流温度（摄氏度）：	245	可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY
认证状态：	Not Qualified	座面最大高度：	2.52 mm
最大供电电压：	5.25 V	最小供电电压：	4.75 V
标称供电电压：	5 V	表面贴装：	YES
技术：	CMOS	温度等级：	COMMERCIAL
端子面层：	TIN SILVER COPPER	端子形式：	BALL
端子节距：	2.54 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	40	宽度：	35 mm
Base Number Matches：	1

A1425A-3PQG100C 数据手册

Accelerator Series FPGAs – ACT 3 Family

Ordering Information

208

A14100

Application (Temperature Range)

C = Commercial (0 to +70°C)

I = Industrial (–40 to +85°C)

M = Military (–55 to +125°C)

B = MIL-STD-883

Package Lead Count

Lead-Free Packaging

Blank = Standard Packaging

G = RoHS Compliant Packaging

Package Type

PG = Ceramic Pin Grid Array

PL = Plastic Leaded Chip Carrier

PQ = Plastic Quad Flatpack

RQ = Plastic Power Quad Flatpack

VQ = Very Thin (1.0 mm) Quad Flatpack

TQ = Thin (1.4 mm) Quad Flatpack

CQ = Ceramic Quad Flatpack

BG = Plastic Ball Grid Array

Speed Grade

Std = Standard Speed

–1 = Approximately 15% faster than Standard

–2 = Approximately 25% faster than Standard

–3 = Approximately 35% faster than Standard

Die Revision

A = 1.0 mm CMOS Process

Part Number

A1415A = 1,500 Gates

A14V15A = 1,500 Gates (3.3 V)

A1425A = 2,500 Gates

A14V25A = 2,500 Gates (3.3 V)

A1440A = 4,000 Gates

A14V40A = 4,000 Gates (3.3 V)

A1460A = 6,000 Gates

A14V60A = 6,000 Gates (3.3 V)

A14100A = 10,000 Gates

A14V100A = 10,000 Gates (3.3 V)

Notes:

1. The –2 and –3 speed grades have been discontinued.

2. The Ceramic Pin Grid Array packages PG100, PG133, and PG175 have been discontinued in all device densities, speed

grades, and temperature grades.

3. The Plastic Ball Grid Array package BG225 has been discontinued in all device densities (specifically for A1460A), all speed

grades, and all temperature grades.

4. Military Grade devices are no longer available for the A1440A device.

5. For more information about discontinued devices, refer to the Product Discontinuation Notices (PDNs) listed below, available on

the Microsemi SoC Products Group website:

PDN March 2001

PDN 0104

PDN 0203

PDN 0604

PDN 1004

Revision 3

123 4 5 6 7...90

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与A1425A-3PQG100C相关器件

型号	品牌	描述	获取价格	数据表
A1425A-3PQG100I	MICROSEMI	FPGA, 310 CLBS, 2500 GATES, 250 MHz, PQFP100, ROHS COMPLIANT, PLASTIC, QFP-100	获取价格
A1425A-3PQG160I	MICROSEMI	Field Programmable Gate Array, 310 CLBs, 2500 Gates, 250MHz, CMOS, PQFP160, ROHS COMPLIANT	获取价格
A1425A-3VQ100C	ETC	Field Programmable Gate Array (FPGA)	获取价格
A1425A-3VQ100I	ETC	Field Programmable Gate Array (FPGA)	获取价格
A1425A-3VQG100C	MICROSEMI	FPGA, 310 CLBS, 2500 GATES, 250 MHz, PQFP100, 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-1	获取价格
A1425A-3VQG100I	MICROSEMI	Field Programmable Gate Array, 310 CLBs, 2500 Gates, 250MHz, CMOS, PQFP100, 1 MM HEIGHT, R	获取价格

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