是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | DIE |
包装说明: | DIE, | 针数: | 28 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.22 | 应用: | CAR STEREO; HANDSET; TRANSFORMER |
商用集成电路类型: | SPEECH SYNTHESIZER WITH RCDG | JESD-30 代码: | R-XUUC-N28 |
JESD-609代码: | e0 | 功能数量: | 1 |
端子数量: | 28 | 片上内存类型: | EEPROM |
最高工作温度: | 50 °C | 最低工作温度: | |
封装主体材料: | UNSPECIFIED | 封装代码: | DIE |
封装形状: | RECTANGULAR | 封装形式: | UNCASED CHIP |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
最长读取时间: | 64 s | 最大供电电压 (Vsup): | 6.5 V |
最小供电电压 (Vsup): | 4.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN LEAD | 端子形式: | NO LEAD |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
ISD2564S | ETC | (1.52 M) |
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|
ISD2564X | WINBOND | SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND |
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|
ISD2575 | WINBOND | ISD2560 |
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|
ISD2575E | WINBOND | Speech Synthesizer With RCDG, 75s, CMOS, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP1-28 |
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|
ISD2575EI | ETC | Single-Chip Voice Record/Playback Devices 32-, 40-, 48-, 64-,60-,75,90-, and 120-Second Du |
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ISD2575EY | WINBOND | Speech Synthesizer With RCDG, 75s, CMOS, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-2 |
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