MITSUBISHI SEMICONDUCTOR <InGaP module>
BA01303
Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module
Specification are subject to change without notice.
DESCRIPTION
OUTLINE DRAWING
BA01303 is a front-end module for triple band
(EGSM900/DCS1800/PCS1900) handheld phone
using InGaP HBT technology.
1
5
20
16
6
FEATURES
・Low voltage operation
Vc=3.5V
・High output power
Po=33.0dBm(min.) @f=880 - 915MHz
Po=30.0dBm(min.) @f=1710 - 1785MHz
Po=30.0dBm(min.) @f=1850 - 1910MHz
・Single voltage operation
・Single power control terminal
・Band select switch
10
15
11
±0.2
8.5
・Tx/Rx select switch
・Surface mount package
・3 Stage amplifier
1.Vc(Vc12)
2.Vc(Vc3)
3.GND
8.Vcont3
9.ANT
10.Vcont2
15.Vc(Vc12)
16.Pin(EGSM)
17.Vband
4.Power Monitor 11.Vcont1
18.GND
(DCS/PCS)
5.Rx(EGSM)
6.Rx(DCS)
12.Power Monitor 19.Vpc
(EGSM) 20.Pin(DCS/PCS)
13.GND
14.Vc(Vc3)
・50ohms matched
・ESD capability >±8kV (@ANT pin)
・GPRS class12 compatible
7.Rx(PCS)
Unit : mm
Terminal metal : AgPt
APPLICATION
Triple band(EGSM/DCS/PCS) handheld phone.
Power
monitor
(DCS/PCS)
Rx Rx
Vc12
Vc3
Vcont2 Vcont3
(DCS)(PCS)
100pF
100pF
100pF
1000pF
+1uF
1000pF
+1uF
100pF
Pin
(DCS/PCS)
Tx/Rx Select
Switch
Coupler
Coupler
Filter
Filter
1000pF
1000pF
Vpc
Band Select
Switch
ANT
Vband
Pin
(EGSM)
Tx/Rx Select
Switch
100pF
100pF
1000pF
+1uF
1000pF
+1uF
Power
monitor
(EGSM)
Rx
(EGSM)
Vc12
Vc3
Vcont1
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable ,
but there is always the possibility that trouble may occur with them .Trouble with semiconductors may lead to personal
injury ,fire or property damage . Remember to give due consideration to safety when making your circuit designs ,
with appropriate measures such as (i) placement of substitutive , auxiliary circuits , (ii) use of non-flammable material or
(iii) prevention against any malfunction or mishap .
Jan./2004
(1/3)