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AT61162E-PM40MMN PDF预览

AT61162E-PM40MMN

更新时间: 2024-02-12 04:42:18
品牌 Logo 应用领域
爱特美尔 - ATMEL 存储内存集成电路静态存储器
页数 文件大小 规格书
14页 638K
描述
Rad Hard 2-Mbit x 8 SRAM Cube

AT61162E-PM40MMN 技术参数

是否Rohs认证: 不符合生命周期:Not Recommended
包装说明:28 X 11 MM, 14.30 MM HEIGHT, 0.80 MM PITCH, DIL-64Reach Compliance Code:not_compliant
ECCN代码:3A001.A.2.CHTS代码:8542.32.00.41
风险等级:5.56最长访问时间:40 ns
I/O 类型:COMMONJESD-30 代码:R-XDSO-G64
长度:28 mm内存密度:16777216 bit
内存集成电路类型:SRAM MODULE内存宽度:8
湿度敏感等级:1功能数量:1
端子数量:64字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:2MX8输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:SSOP
封装等效代码:SOP64,.54,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:3.3 V
认证状态:Not Qualified筛选级别:MIL-PRF-38535 Class N
座面最大高度:14.6 mm最大待机电流:0.016 A
最小待机电流:3 V子类别:SRAMs
最大压摆率:0.06 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30总剂量:200k Rad(Si) V
宽度:10.95 mmBase Number Matches:1

AT61162E-PM40MMN 数据手册

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Features  
Organized as 2M x 8 bits  
Single 3.3V Power Supply  
Stacks of 16 SRAM 128K x 865609E Die  
Access Time: 40 ns  
Very Low Power Consumption  
– Active: 100 mW (Typ)  
– Standby: 1 mW (Typ)  
TTL-Compatible Inputs and Outputs  
Die Designed on 0.35 Micron Process  
No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm2  
Tested up to a Total Dose of 200 krads (Si) according to MIL STD 883 Method 1019  
Wide Temperature Range 55°C to +125°C  
Built and Tested by 3D+, using 3D+ Die Stacking Technology  
Rad Hard  
2-Mbit x 8  
SRAM Cube  
Description  
The AT61162E is a Rad Tolerant module, highly-integrated and very low-power  
CMOS static RAM organized as 2M x 8 bits. It is organized with 16 banks of 1 Mbit.  
Each bank has a 8-bit interface and is selected with 16 specific CS: 0 - 15. Banks are  
selectable by pairs with 8 specific BS: 0 - 7.  
AT61162E  
This module takes full benefit of the 3D+ cube technology, and it is assembled and  
tested by 3D+, using Atmel 65609E 1-Mbit SRAM die: it is built with 8 layers, each one  
housing 2 dies. 10 nF decoupling capacitors are embedded for each memory die.  
Preliminary  
This module brings the solution to applications where fast computing is as mandatory  
as low power consumption, for example: space electronics, portable instruments, or  
embarked systems.  
AT61162E is processed according to the methods of the latest revision of the MIL  
PRF 38535, QML N (QML Q counterpart for plastic).  
The package is a 64 gull wing pins dual in line, 11 mm wide, 28 mm long and 14.3 mm  
height and 0.8 mm pin pitch.  
Rev. 4157D–AERO–06/04  
1

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