Product specification
7
10
SERIES
RT
0402 to 2512 (RoHS Compliant)
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
IEC 60115-1 4.8
PROCEDURE
REQUIREMENTS
Temperature
Coefficient of
Resistance
(T.C.R.)
At +25/–55 °C and +25/+125 °C
Refer to table 2
Formula:
R2–R1
T.C.R= ------------------------- ×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
IEC 60115-1 4.25.1
IEC 60068-2-2
Life/Endurance
At 70±5 °C for 1,000 hours, RCWV applied for
1.5 hours on, 0.5 hour off, still air required
±(0.5%+0.05 Ω)
±(0.5%+0.05 Ω)
High
1,000 hours at 155±5 °C, unpowered
Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202G Method-106G
Moisture
Resistance
Each temperature / humidity cycle is defined at 8
hours, 3 cycles / 24 hours for 10d. with 25 °C /
65 °C 95% R.H, without steps 7a & 7b,
unpowered
±(0.5%+0.05 Ω)
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
MIL-STD-202G Method-107G
Thermal Shock
-55/+125 °C
Number of cycles required is 300. Devices
unmounted
±(0.5%+0.05 Ω) for 10 KΩ to
10 MΩ
±(0.5%+0.05 Ω) for others
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes. Air – Air
IEC 60115-1 4.37
Humidity
(steady state)
Steady state for 1000 hours at 40 °C / 95% R.H.
RCWV applied for 1.5 hours on and
0.5 hour off
±(0.5%+0.05 Ω)
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Oct 21, 2009 V.4