1-to-10 Low Skew, 1, 2 LVCMOS/LVTTL
87946I-147
Datasheet
2.5V, 3.3V Fanout Buffer
General Description
Features
The 87946I-147 is a low skew, ÷1, ÷2 LVCMOS/LVTTL Fanout
Buffer. The 87946I-147 has two selectable single ended clock inputs.
The single ended clock inputs accept LVCMOS or LVTTL input
levels. The low impedance LVCMOS/LVTTL outputs are designed to
drive 50 series or parallel terminated transmission lines. The
effective fanout can be increased from 10 to 20 by utilizing the ability
of the outputs to drive two series terminated lines.
• Ten single ended LVCMOS/LVTTL outputs,
7 typical output impedance
• Selectable LVCMOS/LVTTL CLK0 and CLK1 inputs
• CLK0 and CLK1 can accept the following input levels:
LVCMOS and LVTTL
• Maximum input frequency: 250MHz
• Bank skew: 30ps (maximum)
The divide select inputs, DIV_SELx, control the output frequency of
each bank. The outputs can be utilized in the ÷1, ÷2 or a combination
of ÷1 and ÷2 modes. The master reset input, MR/nOE, resets the
internal frequency dividers and also controls the active and high
impedance states of all outputs.
• Output skew: 175ps (maximum)
• Part-to-part skew: 850ps (maximum)
• Multiple frequency skew: 200ps (maximum)
• 3.3V core, 3.3V or 2.5V output supply modes
• -40°C to 85°C ambient operating temperature
• Lead-free packaging
The 87946I-147 is characterized at full 3.3V for input VDD, and mixed
3.3V and 2.5V for output operating supply mode. Guaranteed bank,
output and part-to-part skew characteristics make the 87946I-147
ideal for those clock distribution applications demanding well defined
performance and repeatability.
Block Diagram
Pin Assignment
Pulldown
CLK_SEL
Pullup
CLK0
CLK1
0
1
0
1
÷1
÷2
3
QA[0:2]
QB[0:2]
32 31 30 29 28 27 26 25
Pullup
Pullup
1
2
3
4
5
6
7
8
CLK_SEL
GND
24
23
22
21
20
VDD
QB0
VDDB
QB1
GND
Pulldown
DIV_SELA
CLK0
0
1
CLK1
3
DIV_SELA
DIV_SELB
DIV_SELC
GND
QB2
VDDB
VDDC
19
18
17
Pulldown
DIV_SELB
9
10 11 12 13 14 15 16
0
1
4
QC[0:3]
Pulldown
Pulldown
87946I-147
DIV_SELC
MR/nOE
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y Package
Top View
©2016 Integrated Device Technology, Inc.
1
Revision C, September 19, 2016