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8415501RA PDF预览

8415501RA

更新时间： 2024-01-09 09:25:56
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
15页 595K
描述
OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

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8415501RA 技术参数

生命周期：Active零件包装代码：DFP
包装说明：CERAMIC, FP-20针数：20
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.38系列：LS
JESD-30 代码：R-GDFP-F20逻辑集成电路类型：BUS DRIVER
位数：8功能数量：1
端口数量：2端子数量：20
最高工作温度：125 °C最低工作温度：-55 °C
输出特性：3-STATE输出极性：INVERTED
封装主体材料：CERAMIC, GLASS-SEALED封装代码：DFP
封装形状：RECTANGULAR封装形式：FLATPACK
传播延迟（tpd）：21 ns认证状态：Qualified
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：4.5 V
标称供电电压 (Vsup)：5 V表面贴装：YES
技术：TTL温度等级：MILITARY
端子形式：FLAT端子位置：DUAL
Base Number Matches：1

8415501RA 数据手册

 浏览型号8415501RA的Datasheet PDF文件第4页浏览型号8415501RA的Datasheet PDF文件第5页浏览型号8415501RA的Datasheet PDF文件第6页浏览型号8415501RA的Datasheet PDF文件第8页浏览型号8415501RA的Datasheet PDF文件第9页浏览型号8415501RA的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CDIP  
CDIP  
Drawing  
SNJ54LS540FK  
SNJ54LS540J  
SNJ54LS540J  
SNJ54LS540W  
SNJ54LS540W  
SNJ54LS541FK  
SNJ54LS541FK  
SNJ54LS541J  
SNJ54LS541J  
SNJ54LS541W  
SNJ54LS541W  
ACTIVE  
ACTIVE  
FK  
J
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
ACTIVE  
J
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
Call TI  
LCCC  
LCCC  
CDIP  
CDIP  
CFP  
FK  
FK  
J
Call TI  
Call TI  
1
1
1
1
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
ACTIVE  
J
ACTIVE  
W
W
ACTIVE  
CFP  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
1...45678910...15

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