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83C196KD20 PDF预览

83C196KD20

更新时间: 2022-11-26 03:15:42
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
25页 1411K
描述
COMMERCIAL CHMOS MICROCONTROLLER

83C196KD20 数据手册

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8XC196KD/8XC196KD20  
Table 5. 8XC196KD Memory Map  
PROCESS INFORMATION  
Description  
Address  
This device is manufactured on PX29.5 or PX29.9, a  
CHMOS III process. Additional process and reliabili-  
ty information is available in the Intel® Quality  
System Handbook:  
External Memory or I/O  
0FFFFH  
0A000H  
Internal ROM/OTPROM or External  
Memory (Determined by EA)  
9FFFH  
2080H  
http://developer.intel.com/design/quality/quality.htm  
Reserved. Must contain FFH.  
(Note 5)  
207FH  
205EH  
PTS Vectors  
205DH  
2040H  
Upper Interrupt Vectors  
ROM/OTPROM Security Key  
203FH  
2030H  
x
x
x
202FH  
2020H  
Reserved. Must contain FFH.  
(Note 5)  
201FH  
201AH  
NOTE:  
1. EPROMs are available as One Time Programmable  
(OTPROM) only.  
Reserved. Must Contain 20H  
(Note 5)  
2019H  
Figure 3. The 8XC196KD Family Nomenclature  
CCB  
2018H  
Reserved. Must contain FFH.  
(Note 5)  
2017H  
2014H  
Table 4. Thermal Characteristics  
Package  
Lower Interrupt Vectors  
2013H  
2000H  
θ
θ
jc  
ja  
Type  
PLCC  
QFP  
35 C/W  
13 C/W  
°
°
Port 3 and Port 4  
1FFFH  
1FFEH  
56 C/W  
°
12 C/W  
°
External Memory  
1FFDH  
0400H  
SQFP  
68 C/W  
15.5 C/W  
°
°
All thermal impedance data is approximate for static air  
conditions at 1W of power dissipation. Values will change  
depending on operation conditions and application. See  
the Intel Packaging Handbook (order number 240800) for a  
description of Intel’s thermal impedance test methodology.  
1000 Bytes Register RAM (Note 1)  
CPU SFR’s (Notes 1, 3)  
03FFH  
0018H  
0017H  
0000H  
NOTES:  
1. Code executed in locations 0000H to 03FFH will be  
forced external.  
2. Reserved memory locations must contain 0FFH unless  
noted.  
3. Reserved SFR bit locations must contain 0.  
4. Refer to 8XC196KC for SFR descriptions.  
5. WARNING: Reserved memory locations must not be  
written or read. The contents and/or function of these lo-  
cations may change with future revisions of the device.  
Therefore, a program that relies on one or more of these  
locations may not function properly.  
4

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