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82V3352TFG8 PDF预览

82V3352TFG8

更新时间: 2024-02-20 02:45:45
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
125页 1460K
描述
Telecom IC, PQFP64

82V3352TFG8 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.34
JESD-30 代码:S-PQFP-G64JESD-609代码:e3
湿度敏感等级:3端子数量:64
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP64,.47SQ,20封装形状:SQUARE
封装形式:FLATPACK电源:3.3 V
认证状态:Not Qualified子类别:Other Telecom ICs
最大压摆率:436 mA标称供电电压:3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
Base Number Matches:1

82V3352TFG8 数据手册

 浏览型号82V3352TFG8的Datasheet PDF文件第3页浏览型号82V3352TFG8的Datasheet PDF文件第4页浏览型号82V3352TFG8的Datasheet PDF文件第5页浏览型号82V3352TFG8的Datasheet PDF文件第7页浏览型号82V3352TFG8的Datasheet PDF文件第8页浏览型号82V3352TFG8的Datasheet PDF文件第9页 
List of Figures  
Figure 1. Functional Block Diagram .............................................................................................................................................................................. 9  
Figure 2. Pin Assignment (Top View) .......................................................................................................................................................................... 10  
Figure 3. Pre-Divider for An Input Clock ..................................................................................................................................................................... 17  
Figure 4. Input Clock Activity Monitoring ..................................................................................................................................................................... 18  
Figure 5. External Fast Selection ................................................................................................................................................................................ 20  
Figure 6. T0 Selected Input Clock vs. DPLL Automatic Operating Mode ................................................................................................................... 26  
Figure 7. On Target Frame Sync Input Signal Timing ................................................................................................................................................. 34  
Figure 8. 0.5 UI Early Frame Sync Input Signal Timing .............................................................................................................................................. 34  
Figure 9. 0.5 UI Late Frame Sync Input Signal Timing ............................................................................................................................................... 35  
Figure 10. 1 UI Late Frame Sync Input Signal Timing ................................................................................................................................................. 35  
Figure 11. IDT82V3352 Power Decoupling Scheme ................................................................................................................................................... 37  
Figure 12. Line Card Application ................................................................................................................................................................................. 38  
Figure 13. Serial Read Timing Diagram (CLKE Asserted Low) ................................................................................................................................... 39  
Figure 14. Serial Read Timing Diagram (CLKE Asserted High) .................................................................................................................................. 39  
Figure 15. Serial Write Timing Diagram ....................................................................................................................................................................... 40  
Figure 16. JTAG Interface Timing Diagram ................................................................................................................................................................. 41  
Figure 17. Recommended PECL Input Port Line Termination .................................................................................................................................. 106  
Figure 18. Recommended PECL Output Port Line Termination ................................................................................................................................ 106  
Figure 19. Recommended LVDS Input Port Line Termination .................................................................................................................................. 108  
Figure 20. Recommended LVDS Output Port Line Termination ................................................................................................................................ 108  
Figure 21. Output Wander Generation ...................................................................................................................................................................... 112  
Figure 22. Input / Output Clock Timing ...................................................................................................................................................................... 113  
Figure 23. 64-Pin PP Package Dimensions (a) (in Millimeters) ................................................................................................................................. 120  
Figure 24. 64-Pin PP Package Dimensions (b) (in Millimeters) ................................................................................................................................. 121  
Figure 25. 64-Pin EDG Package Dimensions (a) (in Millimeters) .............................................................................................................................. 122  
Figure 26. 64-Pin EDG Package Dimensions (b) (in Millimeters) .............................................................................................................................. 123  
Figure 27. EDG64 Recommended Land Pattern with Exposed Pad (in Millimeters) ................................................................................................. 124  
List of Figures  
6
March 23, 2009  

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