TVS Diodes
Surface Mount – 85000000WW >> 85..00SSMMDDJJ sseerriieess
Soldering Parameters
Reflow Condition
Lead–free assembly
tp
-Temperature Min (Ts(min)
)
150°C
TP
Pre Heat -Temperature Max (Ts(max)
)
200°C
Ramp-up
Critical Zone
to T
T
L
P
TL
-Time (min to max) (ts)
60 – 180 secs
tL
Ts(max)
Average ramp up rate (LiquidusTemp (TA)
to peak
3°C/second max
Ramp-down
Ts(min)
TS(max) toTA - Ramp-up Rate
3°C/second max
217°C
ts
Preheat
-Temperature (TL) (Liquidus)
Reflow
-Time (min to max) (tL)
60 – 150 seconds
260+0/-5 °C
25˚C
t 25˚C to Peak
Time (t)
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
8 minutes Max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
Environmental Specifications
HighTemp. Storage
HTRB
JESD22-A103
JESD22-A108
JESD22-A104
Physical Specifications
Temperature Cycling
Weight
Case
0.011 ounce ,0.3 grams
MSL
JEDEC-J-STD-020, Level 1
JESD22-A101
JEDEC DO214AB. Molded plastic body
over glass passivated junction
H3TRB
RSH
Color band denotes positive end (cathode)
except Bidirectional.
JESD22-A111
Polarity
MatteTin-plated leads, Solderable per
JESD22-B102
Terminal
Dimensions
DO-214AB (SMC J-Bend)
Inches
Millimeters
Cathode Band
(for Uni-directional products only)
Dimensions
Min
Max
0.126
0.280
0.245
0.103
0.060
0.008
0.320
0.012
-
Min
2.900
6.600
5.590
2.060
0.760
-
Max
A
B
C
D
E
F
G
H
I
0.114
0.260
0.220
0.079
0.030
-
3.200
7. 110
6.220
2.620
1.520
0.203
8.130
0.305
-
C
A
D
B
H
0.305
0.006
0.129
0.094
-
7.750
0.152
3.300
2.400
-
F
E
G
J
K
L
J
-
-
K
L
0.165
-
4.200
-
0.094
2.400
I
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/10/19