73M2901CL-IGV

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73M2901CL-IGV 数据手册

73M2901CE Data Sheet

DS_2901CE_031

Revision History

Revision Date

Description

2.2.1

3.1

4/20/2004

First publication.

12/14/2007 Replaced 32QFN punched with SAWN package, removed leaded package

option, updated schematic and minor clean up.

3.2

3.3

1/21/2008

Changed dimension of bottom exposed pad on 32QFN mechanical package

figure.

4/3/2009

Formatted to new Teridian style.

Assigned new document number.

Minor corrections have been made to Section 5.3 and Section 6.3.

Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.

Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.

All other trademarks are the property of their respective owners.

Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly

contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms

and Conditions. The company assumes no responsibility for any errors which may appear in this

document, reserves the right to change devices or specifications detailed herein at any time without

notice and does not make any commitment to update the information contained herein. Accordingly, the

reader is cautioned to verify that this document is current by comparing it to the latest version on

http://www.teridian.com or by checking with your sales representative.

Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618

TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com

Rev. 3.3

1...19 20 2122

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