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71M6531D-IM/F

更新时间: 2024-02-23 02:14:02
品牌 Logo 应用领域
TERIDIAN /
页数 文件大小 规格书
115页 2363K
描述
Energy Meter IC

71M6531D-IM/F 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:QFN
包装说明:VQCCN, LCC68,.32SQ,16针数:68
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.31
Is Samacsys:N可调阈值:NO
模拟集成电路 - 其他类型:POWER SUPPLY MANAGEMENT CIRCUITJESD-30 代码:S-XQCC-N68
长度:8 mm信道数量:1
功能数量:1端子数量:68
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:VQCCN
封装等效代码:LCC68,.32SQ,16封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
座面最大高度:0.8 mm子类别:Other Analog ICs
最大供电电流 (Isup):12 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:0.4 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mmBase Number Matches:1

71M6531D-IM/F 数据手册

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FDS 6531/6532 005  
Data Sheet 71M6531D/F-71M6532D/F  
Figures  
Figure 1: 71M6531D/F IC Functional Block Diagram ...................................................................................8  
Figure 2: 71M6532D/F IC Functional Block Diagram ...................................................................................9  
Figure 3: General Topology of a Chopped Amplifier ..................................................................................13  
Figure 4: CROSS Signal with CHOP_E = 00...............................................................................................13  
Figure 5: AFE Block Diagram (Shown for the 71M6532D/F)......................................................................14  
Figure 6: Samples from Multiplexer Cycle ..................................................................................................17  
Figure 7: Accumulation Interval ..................................................................................................................18  
Figure 8: Interrupt Structure........................................................................................................................36  
Figure 9: Optical Interface...........................................................................................................................41  
Figure 10: Connecting an External Load to DIO Pins.................................................................................46  
Figure 11: 3-Wire Interface. Write Command, HiZ=0. ...............................................................................49  
Figure 12: 3-Wire Interface. Write Command, HiZ=1 ................................................................................49  
Figure 13: 3-Wire Interface. Read Command............................................................................................49  
Figure 14: 3-Wire Interface. Write Command when CNT=0......................................................................49  
Figure 15: 3-Wire Interface. Write Command when HiZ=1 and WFR=1. ..................................................50  
Figure 16: SPI Slave Port: Typical Read and Write operations..................................................................51  
Figure 17: Functions defined by V1 ............................................................................................................51  
Figure 18: Voltage, Current, Momentary and Accumulated Energy...........................................................53  
Figure 19: Timing Relationship between ADC MUX, Compute Engine......................................................54  
Figure 20: RTM Output Format...................................................................................................................54  
Figure 21: Operation Modes State Diagram ...............................................................................................55  
Figure 22: Transition from BROWNOUT to MISSION Mode when System Power Returns ......................58  
Figure 23: Power-Up Timing with V3P3SYS and VBAT tied together........................................................58  
Figure 24: Power-Up Timing with VBAT only..............................................................................................59  
Figure 25: Wake Up Timing ........................................................................................................................60  
Figure 26: MPU/CE Data Flow....................................................................................................................61  
Figure 27: MPU/CE Communication...........................................................................................................61  
Figure 28: Resistive Voltage Divider...........................................................................................................62  
Figure 29: CT with Single Ended (Left) and Differential Input (Right) Connection .....................................62  
Figure 30: Resistive Shunt (Left) and Rogowski Sensor (Right) Connection.............................................62  
Figure 31: Connecting LCDs.......................................................................................................................64  
Figure 32: I2C EEPROM Connection ..........................................................................................................65  
Figure 33: Three-Wire EEPROM Connection.............................................................................................65  
Figure 34: Connections for UART0.............................................................................................................66  
Figure 35: Connection for Optical Components..........................................................................................66  
Figure 36: Voltage Divider for V1................................................................................................................67  
Figure 37: External Components for the RESET Pin: Push-button (Left), Production Circuit (Right) ........67  
Figure 38: External Components for the Emulator Interface ......................................................................68  
Figure 39: Connecting a Battery .................................................................................................................68  
Figure 40: CE Data Flow: Multiplexer and ADC..........................................................................................93  
Figure 41: CE Data Flow: Scaling, Gain Control, Intermediate Variables ..................................................94  
Figure 42: CE Data Flow: Squaring and Summation Stages......................................................................94  
Figure 43: SPI Slave Port (MISSION Mode) Timing.................................................................................103  
Figure 44: Wh Accuracy, 0.1 A to 200 A at 240 V/50 Hz and Room Temperature ..................................104  
Figure 45: QFN-68 Package Outline, Top and Side View ........................................................................105  
Figure 46: QFN-68 Package Outline, Bottom View Table 83: QFN 68 Package Dimensions (in mm) ....105  
Figure 47: Pinout for QFN-68 Package.....................................................................................................106  
Figure 48: PCB Land Pattern for QFN 68 Package..................................................................................107  
Figure 49: PCB Land Pattern for LQFP-100 Package..............................................................................108  
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