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71M6201-ILF PDF预览

71M6201-ILF

更新时间: 2024-02-10 14:26:42
品牌 Logo 应用领域
美信 - MAXIM 传感器温度传感器监控
页数 文件大小 规格书
19页 374K
描述
On-Chip Temperature Sensor Enables Localized Digital Temperature On-Chip Power Monitoring

71M6201-ILF 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:SOIC
包装说明:SOP, SOP8,.25针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.84
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-PDSO-G8
长度:4.93 mm湿度敏感等级:1
功能数量:1端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V认证状态:Not Qualified
座面最大高度:1.73 mm子类别:Other Analog ICs
最大供电电流 (Isup):1.05 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.5 V标称供电电压 (Vsup):3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.94 mm

71M6201-ILF 数据手册

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PDS_6xxx_010  
71M6xxx Data Sheet  
The 71M6xxx isolated sensors provide a continuous data stream of ADC data plus an independent data  
stream that contains auxiliary information as requested by the 71M654x. The ADC data is processed by  
CE code in the 71M654x and stored in CE RAM. Auxiliary information is processed by the MPU of the  
71M654x using I/O RAM registers.  
Basic settings and functions of the 71M6xxx can be controlled by various I/O RAM registers in the  
71M654x. The command sent towards the 71M6xxx is placed in the RCMD[4:2] register of the 71M654x,  
with further specification contained in the TMUXRn[2:0] register. Refer to the 71M654x data sheets for  
details.  
Table 1 shows the allowable combinations of values in RCMD[4:2] and TMUXRn[2:0] , and the achieved  
operation along with the type and format of data sent back by the 71M6xxx isolated sensors.  
Table 1: Remote Interface Commands  
Read  
Operation/Command  
RCMD[4:2] TMUXRn[2:0]  
R6K_RD [15:0]  
001  
001  
001  
00X  
01X  
10X  
TRIMT (see note), use bits [8:1]  
TRIMBGC (see note), use bits [15:6]  
TRIMBGA (see note), use bits [15:8]  
TRIMBGB bits [15:8], TRIMBGD bits [7:0]  
(see note)  
Chip-characteristic  
temperature data  
001  
11X  
010  
010  
010  
110  
00X  
01X  
10X  
111  
Temperature  
Supply voltage  
Chip version  
Reset  
Output of the temperature sensor, bits [10:0]  
Supply voltage measurement , bits [7:0]  
Chip version code, use bits [15:8]  
Note: TRIMBGA to TRIMBGD and TRIMT are values used for characterizing the individual 71M6xxx over temperature. Availability  
of TRIMBGA to TRIMBGD and TRIMT depends on the part number (see Table 10 for details).  
The remote interface commands listed in Table 1 enable the 71M654x to gather the following information  
from the 71M6xxx:  
Output of the temperature sensor  
Information on how the device is characterized over temperature  
Supply voltage  
Chip version code  
The control commands listed in Table 1 enable the 71M654x to initiate the following actions in the  
71M6xxx:  
Read the 71M6xxx temperature sensor  
Read the 71M6xxx VCC sensor  
Hardware reset  
With hardware and temperature characterization information on each connected 71M6xxx isolated sensor  
available to the 71M654x host MPU, temperature compensation of the energy measurement can be  
implemented based on the individual temperature characteristics of the 71M6xxx isolated sensors. For  
example, when the 71M6xxx are used in a polyphase meter containing three shunt resistors, the  
temperature increase in each 71M6xxx can be monitored and used to compensate for the temperature  
coefficient of the 71M6xxx VREF and the corresponding shunt resistor.  
3
APPLICATIONS INFORMATION  
3.1  
Product Selection  
A low-noise differential-input preamplifier applies gain to the signal from the current sensor to the optimal  
input range of the ADC. The current sensor is connected to the inputs of the preamplifier through INP and  
INN. The output of the preamplifier connects directly to the input of the ADC. See 5 Ordering Information  
for available part types. Shunt resistances from 736µΩ to as low as 50µΩ can be accommodated,  
depending on desired current range and part type.  
v1.2  
© 2008–2011 Teridian Semiconductor Corporation  
5
 
 
 

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