RF/Microwave Capacitors
RF/Microwave Multilayer Capacitors (MLC)
700C Series NPO Porcelain and Ceramic Multilayer Capacitors
MECHANICAL CONFIGURATIONS
BODY DIMENSIONS
LEAD AND TERMINATION
OUTLINES
INCHES (mm)
DIMENSIONS AND MATERIALS
SERIES
& CASE
SIZE
CASE SIZE
& TYPE
TERM.
CODE
W/T IS A
LENGTH
(L)
WIDTH
(W)
THICKNESS
(T)
OVERLAP
(Y)
TERMINATION SURFACE
MATERIALS
Pkg Type Pkg Code
T&R, 250
or
500 pcs
Tray, 36 or
180 pcs
T&R, 250
or
500 pcs
Tray, 36 or
180 pcs
Y
C
Tin /Lead, Solder Plated
over Nickel Barrier
Termination
T250 or T
J36 or
J180
.230+.020 -.010
(5.84+0.51-0.25)
W
700C
700C
W
P
L
T
Solder Plate
C
Y
Heavy Tin/Lead Coated,
over
T250 or T
J36 or
J180
.230+.025 -.010
(5.84+0.64-0.25)
.040 (1.02)
max.
W
Nickel Barrier
Termination
.145 (3.68)
max. for
capacitance
values
≤ 680 pF;
.165 (4.19)
max. for
capacitance
values
> 680 pF.
L
T
Pellet
C
T&R, 250
or
500 pcs
Tray, 36 or
180 pcs
Y
RoHS Compliant
Tin Plated over
Nickel Barrier
Termination
T250 or T
J36 or
J180
.250 ±.015
(6.35 ±0.38)
.230+.020 -.010
(5.84+0.51-0.25)
W
700C
T
Solderable
Nickel Barrier
T
L
T
L
High Purity
Silver Leads
LL = .500 (12.7) min.
WL = .240 ±.005
(6.10 ±.127)
TL = .004 ±.001
(.102 ±.025)
Leads are Attached with
High Temperature Solder.
L
L
C
Tray, 24 or
60 pcs
700C
700C
MS
AR
J24 or J60
B24
W
L
W
Microstrip
L
T
.245 ±.025
(6.22 ±0.64)
N/A
T
L
C
L
L
Box, 24
W
L
W
Axial Ribbon
L
T
NON-MAGNETIC MECHANICAL CONFIGURATION
BODY DIMENSIONS
LEAD AND TERMINATION
OUTLINES
W/T IS A
INCHES (mm)
DIMENSIONS AND MATERIALS
SERIES
& CASE
SIZE
CASE SIZE
& TYPE
TERM.
CODE
LENGTH
(L)
WIDTH
(W)
THICKNESS OVERLAP
TERMINATION SURFACE
MATERIALS
Pkg Type
Pkg Code
(T)
(Y)
C
Y
Tin/Lead, Solder Plated T&R, 250 or
.230+.020 -.010
over
500 pcs
T250 or T
W
700C
700C
WN
PN
(5.84+0.51-0.25)
Non-Magnetic Barrier
Termination
Tray, 36 or J36 or J180
180 pcs
L
T
Solder Plate
C
Y
Heavy Tin/Lead Coated, T&R, 250 or
.230+.025 -.010
(5.84+0.64-0.25)
over
500 pcs
Tray, 36 or J36 or J180
180 pcs
T250 or T
.040
(1.02)
max.
W
W
Non-Magnetic Barrier
Termination
.145 (3.68)
max. for
capacitance
values
≤ 680 pF;
T
L
Pellet
C
Y
RoHS Compliant
Tin Plated over
Non-Magnetic Barrier
Termination
T&R, 250 or
.250 ±.015
.230+.020 -.010
(5.84+0.51-0.25)
500 pcs
T250 or T
(6.35 ±0.38) .165 (4.19)
max. for
700C
TN
Tray, 36 or J36 or J180
180 pcs
Solderable
Nickel
Barrier
L
T
capacitance
values
> 680 pF.
T
L
C
High Purity
Silver Leads
L = .500 (12.7) min.
L WL = .240 ±.005
(6.10 ±.127)
TL = .004 ±.001
(.102 ±.025)
Leads are Attached with
High Temperature Solder.
L
L
Tray, 24 or
J24 or J60
60 pcs
700C
700C
MN
AN
W
L
W
Microstrip
C
L
T
.245 ±.025
(6.22 ±0.64)
N/A
T
L
L
L
Tray, 24 or
J24 or J60
60 pcs
W
L
W
Axial
Ribbon
L
T
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
536
TDS-RFM-0019 | Rev 1
rf microwave products
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