MLCC ARRAYS
◆ 可靠性测试
Reliability Test
项目
技术规格
测 试 方 法
Item
Technical Specification
Test Method and Remarks
测试频率
测试电压
标称容量
Capacitance
Measuring
Frequency
Measuring
Voltage
应符合指定的误差级别
Ⅰ类
Should be within the specified
tolerance.
ClassⅠ
≤1000pF
1MHz±10%
1KHz±10%
1.0±0.2Vrms
>1000 pF
容量
测试温度: 25℃±3℃
测试频率: 1KHz±10%
测试电压: 1.0±0.2Vrms
Test Temperature: 25℃±3℃
Test Frequency: 1KHz±10%
Test Voltage: 1.0±0.2Vrms
Capacitance
应符合指定的误差级别
Should be within the specified
tolerance.
Ⅱ类
Class Ⅱ
Ⅰ类
C≤10 nF, Ri≥50000MΩ
C>10 nF, Ri•CR≥500S
测试电压:额定电压
测试时间: 60±5 秒
ClassⅠ
测试湿度:≤75%
测试温度: 25℃±3℃
测试充放电电流:≤50mA
Measuring Voltage: Rated Voltage
Duration: 60±5s
Test Humidity: ≤75%
Test Temperature: 25℃±3℃
Test Current: ≤50mA
C≤25 nF, Ri≥10000MΩ
X7R
绝缘电阻(IR)
Insulation
Resistance
C>25 nF, Ri•CR>100S
Ⅱ类
Class Ⅱ
C≤25 nF, Ri≥4000MΩ
Y5V
C>25 nF, Ri•CR>100S
测试频率
标称容量
测试电压
DF
Measuring
Capacitance
Measuring
Voltage
Frequency
Ⅰ类
≤0.56%
Cr<5 pF
1MHz±10%
1MHz±10%
1MHz±10%
1KHz±10%
ClassⅠ
≤1.5[(150/Cr)+7]×10-4
5pF≤Cr<50 pF
50pF≤Cr ≤1000 pF
>1000 pF
1.0±0.2Vrms
≤0.15%
损耗角正切
(DF, tanδ)
Dissipation
Factor
≤0.15%
≥50V
25V
16V
X7R
测试温度: 25℃±3℃
测试频率: 1KHz±10%
≤2.5%
≤3.5%
≤5.0%
Ⅱ类
测试电压: 1.0±0.2Vrms
≥25V
16V
Test Temperature: 25℃±3℃
Test Frequency: 1KHz±10%
Test Voltage: 1.0±0.2Vrms
Class Ⅱ
Y5V
C<1.0µF:≤7.0%
C≥1.0µF:≤9.0%
≤15%
测量电压:Ⅰ类:300%额定电压
Ⅱ类:250%额定电压
介质耐电强度
(DWV)
Dielectric
Withstanding
Voltage
时间: 1~5 秒
充/放电电流:不应超过 50mA
不应有介质被击穿或损伤
No breakdown or damage.
Measuring Voltage:
ClassⅠ:300% Rated voltage
ClassⅡ:250% Rated voltage
Duration: 1~5s
Charge/ Discharge Current: 50mA max.
端头结合强度
外观无可见损伤
No visible damage.
施加的力:5N
Applied Force: 5N
时间:10±1S
Duration: 10±1S
Termination
Adhesion
将电容在 80~120℃的温度下预热 10~30 秒.
Preheating conditions:80 to 120℃; 10~30s.
上锡率应大于 95%
外观:无可见损伤.
有铅焊料:(Sn/Pb:63/37) 无铅焊料:
可焊性
Solderability
浸锡温度: 235 ±5℃
浸锡时间: 2±0.5s
Solder Temperature:
235±5℃
浸锡温度: 245±5℃
At least 95% of the terminal electrode is covered
by new solder.
Visual Appearance: No visible damage.
浸锡时间: 2±0.5s
Solder Temperature:
245±5℃
Duration: 2±0.5s
Duration: 2±0.5s