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61083-001 PDF预览

61083-001

更新时间: 2024-01-06 22:57:13
品牌 Logo 应用领域
MII 晶体晶体管开关
页数 文件大小 规格书
2页 86K
描述
SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

61083-001 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-CDSO-N4
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.21.00.95
风险等级:5.02Is Samacsys:N
外壳连接:COLLECTOR最大集电极电流 (IC):0.15 A
集电极-发射极最大电压:20 V配置:SINGLE
最小直流电流增益 (hFE):100JESD-30 代码:R-CDSO-N4
元件数量:1端子数量:4
最高工作温度:200 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:PNP最大功率耗散 (Abs):0.4 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子形式:NO LEAD
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICON最大关闭时间(toff):300 ns
最大开启时间(吨):45 nsBase Number Matches:1

61083-001 数据手册

 浏览型号61083-001的Datasheet PDF文件第2页 
61083  
SURFACE MOUNT (PNP)  
GENERAL PURPOSE TRANSISTOR  
(2N2907AUA)  
Mii  
OPTOELECTRONIC PRODUCTS  
DIVISION  
Features:  
Applications:  
Hermetically sealed  
Analog Switches  
Miniature package to minimize circuit board area  
Ceramic surface mount package  
Signal Conditioning  
Small Signal Amplifiers  
High Density Packaging  
MIL-PRF-19500 screening available  
DESCRIPTION  
The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic  
package is ideal for designs where board space and device weight are important requirements. This device is available  
custom binned to customer specifications or screened to MIL-PRF-19500.  
ABSOLUTE MAXIMUM RATINGS  
Collector-Base Voltage...............................................................................................................................................................60V  
Collector-Emitter Voltage............................................................................................................................................................60V  
Emitter-Collector Voltage..............................................................................................................................................................5V  
Continuous Collector Current ............................................................................................................................................... 600mA  
Power Dissipation (Derate at the rate of 2.28 mW/°C above 25°C) .................................................................................. 400mW  
Maximum Junction Temperature............................................................................................................................................200°C  
Operating Temperature (See part selection guide for actual operating temperature) ......................................... -65°C to +200°C  
Storage Temperature............................................................................................................................................. -65°C to +200°C  
Lead Soldering Temperature (vapor phase reflow for 30 seconds) .....................................................................................215°C  
Package Dimensions  
Schematic Diagram  
1
C
0.225 [5.72]  
0.215 [5.46]  
0.075 [1.91]  
0.061 [1.55]  
0.155 [1.40]  
0.145 [3.68]  
PIN 1  
IDENTIFIER  
0.048 [1.22]  
0.032 [0.81]  
3 PL  
2
3
0.028 [0.17]  
0.022 [0.56]  
1
4
0.055 [1.40]  
0.045 [1.14]  
0.088 [2.24]  
0.072 [1.83]  
E
B
3
2
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]  
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION 725 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 487-6918  
www.micropac.com E-MAIL: optosales@micropac.com  
8 - 2  

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