Datasheet > 600R150F

600R150F

更新时间： 2024-02-04 21:12:48

品牌	Logo	应用领域
力特 - LITTELFUSE		过载保护电阻器
页数	文件大小	规格书
6页	685K
描述
PTC Resettable Fuse, 6ohm, Through Hole Mount, RADIAL LEADED, HALOGEN FREE & ROHS COMPLIANT

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技术参数
数据手册

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600R150F 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	RADIAL LEADED, HALOGEN FREE & ROHS COMPLIANT
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8533.40.80.70	风险等级：	2.17
其他特性：	6 TO 17 OHMS MEASURED AT 20 DEG CEL	JESD-609代码：	e3
安装特点：	THROUGH HOLE MOUNT	端子数量：	2
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装形状：	RECTANGULAR PACKAGE	包装方法：	BULK
额定（AC）电压（URac）：	600 V	电阻：	6 Ω
电阻器类型：	PTC RESETTABLE FUSE	子类别：	Non-linear Resistors
表面贴装：	NO	端子面层：	Matte Tin (Sn)
端子位置：	RADIAL	端子形状：	WIRE
热敏电阻器应用：	OVERLOAD PROTECTION	Base Number Matches：	1

600R150F 数据手册

POLY-FUSE Resettable PTCs

Radial Leaded > 600R Series

Protection Application Guide

Region/Speciﬁcation

Application

Device Selection

*Access network equipment

Remote terminal

North America

Telcordia GR-1089

600R150

600R160

Repeaters

WAN equipment

Cross -connect

Customer and IT equipment

Analog modems

North America

TIA-968-A, UL60950

ADSL, XDSL modems

Phone sets, PBX systems

Internet appliances

POS terminals

600R150

600R160

Central Ofﬁce

POTS/ISDN linecards

T1/E1/J1 linecards

ADSL/VDSL splitters

CSU/DSU

North America

Telcordia GR-1089

600R150

600R160

North America

Telcordia GR-1089

South America/Asia/Europe

ITU K.20 and K.21

*Intrabuilding communication systems

LAN, VOIP cards

600R150

600R160

Local loop handsets

*Resistance binned parts are recommended

Soldering Parameters -Wave Soldering

Condition

Wave Soldering

PeakTemp/ DurationTime

260°C 5 Sec

Soldering

Cooling

260

220

220°C

2 Sec ~ 20 Sec

Preheat 140°C~ 180°C

Storage Condition

180 Sec ~ 210 Sec

Preheating

0°C~35°C, 70%RH

190

160

• Recommended soldering methods: heat element oven or

N₂environment for lead–free

• Devices are designed to be wave soldered to the bottom

side of the board.

2 to 5

20-30

180 to 210

• Devices can be cleaned using standard industry methods

and solvents.

Time(s)

•This proﬁle can be used for lead-free device

Note: If soldering temperatures exceed the recommended

proﬁle, devices may not meet the performance

requirements.

Additional Information

Saꢀꢁles

ꢀatasꢁeet

Resꢀꢁꢂꢃes

Speciﬁcations are subject to change without notice.

Revised: 03/22/17

1 234 5 6

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