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5962R9951703V9A PDF预览

5962R9951703V9A

更新时间: 2024-02-26 05:01:14
品牌 Logo 应用领域
德州仪器 - TI 电源电路线性稳压器IC
页数 文件大小 规格书
36页 1265K
描述
耐辐射 QMLV、4.2V 至 40V 输入、1.5A 可调输出线性稳压器 | Y | 0 | -55 to 125

5962R9951703V9A 技术参数

生命周期:Obsolete包装说明:SOP,
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.62
Is Samacsys:N最大差分输入-输出电压:40 V
最小差分输入-输出电压:3 VJESD-30 代码:R-GDSO-G16
JESD-609代码:e0长度:9.91 mm
功能数量:1端子数量:16
工作温度TJ-Max:150 °C最大输出电流 1:0.5 A
最大输出电压 1:37 V最小输出电压 1:1.2 V
封装主体材料:CERAMIC, GLASS-SEALED封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified调节器类型:ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
筛选级别:MIL-PRF-38535 Class V座面最大高度:2.33 mm
表面贴装:YES技术:BIPOLAR
端子面层:TIN LEAD端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
总剂量:100k Rad(Si) V宽度:6.35 mm
Base Number Matches:1

5962R9951703V9A 数据手册

 浏览型号5962R9951703V9A的Datasheet PDF文件第1页浏览型号5962R9951703V9A的Datasheet PDF文件第2页浏览型号5962R9951703V9A的Datasheet PDF文件第3页浏览型号5962R9951703V9A的Datasheet PDF文件第5页浏览型号5962R9951703V9A的Datasheet PDF文件第6页浏览型号5962R9951703V9A的Datasheet PDF文件第7页 
LM117QML, LM117QML-SP  
SNVS356D MARCH 2006REVISED APRIL 2013  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)  
Power Dissipation(2)  
Internally Limited  
+40V, 0.3V  
65°C TA +150°C  
+150°C  
Input-Output Voltage Differential  
Storage Temperature  
Maximum Junction Temperature (TJmax  
Lead Temperature Metal Package  
300°C  
Thermal Resistance  
θJA  
T0 Still Air  
39°C/W  
T0 500LF/Min Air flow  
PFM Still Air  
14°C/W  
186°C/W  
64°C/W  
PFM 500LF/Min Air flow  
CFP "WG" (device 03, 05) Still Air  
CFP "WG" (device 03, 05) 500LF/Min Air flow  
CFP "GW" (device 06, 07) Still Air  
CFP "GW" (device 06, 07) 500LF/Min Air flow  
LCCC Still Air  
115°C/W  
66°C/W  
130°C/W  
80°C/W  
88°C/W  
LCCC 500LF/Min Air flow  
T0  
62°C/W  
θJC  
1.9°C/W  
21°C/W  
PFM Metal Can  
CFP "WG" (device 03, 05)(3)  
CFP "GW" (device 06, 07)  
LCCC  
3.4°C/W  
7°C/W  
12°C/W  
Package Weight  
PFM Metal Can  
960mg  
CFP "WG" (device 03, 05)  
CFP "GW" (device 06, 07)  
365mg  
410mg  
(4)  
ESD Tolerance  
3KV  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the  
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may  
degrade when the device is not operated under the listed test conditions.  
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),  
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any  
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. "Although power  
dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the PFM, LCCC, and CFP packages,  
and 20W for the TO package."  
(3) The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full  
advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either  
metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be  
calculated using θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat  
transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package  
base. The stated θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance  
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and  
must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.  
(4) Human body model, 100 pF discharged through a 1.5 kΩ resistor.  
Recommended Operating Conditions  
Operating Temperature Range  
55°C TA +125°C  
Input Voltage Range  
4.25V to 41.25V  
4
Submit Documentation Feedback  
Copyright © 2006–2013, Texas Instruments Incorporated  
Product Folder Links: LM117QML LM117QML-SP  

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