Datasheet > 5962F9563202VXC

5962F9563202VXC

更新时间： 2022-03-30 12:25:41

品牌	Logo	应用领域
英特矽尔 - INTERSIL		驱动器
页数	文件大小	规格书
4页	317K
描述
Radiation Hardened Quad Differential Line Drivers

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5962F9563202VXC 数据手册

HS-26CT31RH, HS-26CT31EH

Die Characteristics

DIE DIMENSIONS:

Substrate:

96.5 milx195 milsx21 mils

(2450x4950)

AVLSI1RA

Backside Finish:

INTERFACE MATERIALS:

Glassivation:

Silicon

ASSEMBLY RELATED INFORMATION:

Substrate Potential (Powered Up):

Type: PSG (Phosphorus Silicon Glass)

Thickness: 10kÅ ± 1kÅ

Metallization:

ADDITIONAL INFORMATION:

Worst Case Current Density:

M1: Mo/TiW

Thickness: 5800Å

M2: Al/Si/Cu (Top)

Thickness: 10kÅ ±1kÅ

<2.0x10 A/cm

Bond Pad Size:

110µmx100µm

FN2929.4

February 23, 2012

1 234

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型号	品牌	描述	获取价格	数据表
5962F9563501QXC	INTERSIL	Radiation Hardened Real Time Express⑩ Microco	获取价格
5962F9563501QXX	WEDC	Microcontroller, 16-Bit, 8MHz, CMOS	获取价格
5962F9563501QYC	INTERSIL	Radiation Hardened Real Time Express⑩ Microco	获取价格
5962F9563501V9A	INTERSIL	Radiation Hardened Real Time Express⑩ Microco	获取价格
5962F9563501VXC	INTERSIL	Radiation Hardened Real Time Express⑩ Microco	获取价格
5962F9563501VXX	WEDC	Microcontroller, 16-Bit, 8MHz, CMOS	获取价格