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5962-9957301QZA PDF预览

5962-9957301QZA

更新时间: 2024-02-03 00:32:54
品牌 Logo 应用领域
赛灵思 - XILINX /
页数 文件大小 规格书
31页 249K
描述
QPro Virtex 2.5V QML High-Reliability FPGAs

5962-9957301QZA 技术参数

生命周期:Active零件包装代码:QFP
包装说明:CERAMIC, QFP-228针数:228
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.39.00.01风险等级:5.25
CLB-Max的组合延迟:0.8 nsJESD-30 代码:S-CQFP-F228
长度:39.37 mm可配置逻辑块数量:3456
等效关口数量:661111端子数量:228
最高工作温度:125 °C最低工作温度:-55 °C
组织:3456 CLBS, 661111 GATES封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:GQFF封装形状:SQUARE
封装形式:FLATPACK, GUARD RING可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Qualified筛选级别:MIL-PRF-38535 Class Q
座面最大高度:3.302 mm最大供电电压:2.625 V
最小供电电压:2.375 V标称供电电压:2.5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:FLAT
端子节距:0.635 mm端子位置:QUAD
宽度:39.37 mm

5962-9957301QZA 数据手册

 浏览型号5962-9957301QZA的Datasheet PDF文件第25页浏览型号5962-9957301QZA的Datasheet PDF文件第26页浏览型号5962-9957301QZA的Datasheet PDF文件第27页浏览型号5962-9957301QZA的Datasheet PDF文件第28页浏览型号5962-9957301QZA的Datasheet PDF文件第29页浏览型号5962-9957301QZA的Datasheet PDF文件第30页 
R
QPro Virtex 2.5V QML High-Reliability FPGAs  
SMD (Class Q) Odering Options  
5962 9957201 Q Y C  
Generic Standard  
Microcircuit Drawing (SMD)  
Lead Finish  
Package Type  
QML Certified MIL-PRF-38535(1)  
Device Type  
Valid SMD Combinations  
SMD Number  
Device  
Pkg Markings  
Lead Finish  
Gold Plate  
5962-9957201QYC  
5962-9957201QZC  
5962-9957201NTB  
5962-9957201NNA  
5962-9957201NUA  
5962-9957301QYC  
5962-9957301QZC  
5962-9957301NTB  
5962-9957301NUA  
5962-9957401QXC  
5962-9957401NUA  
XQV300-4CB228Q  
XQV300-4CB228Q  
XQV300-4PQ240N  
XQV300-4BG352N  
XQV300-4BG432N  
XQV600-4CB228Q  
XQV600-4CB228Q  
XQV600-4HQ240N  
XQV600-4BG432N  
XQV1000-4CG560Q  
XQV1000-4BG560N  
Lid  
Base  
Gold Plate  
-
Solder Plate  
Solder Ball  
Solder Ball  
Gold Plate  
-
-
Lid  
Base  
Gold Plate  
-
-
-
-
Solder Plate  
Solder Ball  
Solder Column  
Solder Ball  
Notes:  
1. Type N designates QML Plastic.  
Revision History  
The following table shows the revision history for this document  
Date  
Version  
1.0  
Revision  
10/04/99  
06/01/00  
02/13/01  
11/05/01  
11/15/01  
12/05/01  
Initial Xilinx release.  
1.1  
Upated format.  
1.2  
Updated Temperature Specifications.  
1.3  
Changed V600 Power-up temp min to 55°C. Added L33 as Bank 7 VREF. Updated format.  
Fixed boken links. Added note for VCCO banking rules for PQ240 package.  
Corrected Table 5 pin description for pin 9 and pin 39.  
1.4  
1.5  
DS002 (v1.5) December 5, 2001  
www.xilinx.com  
31  
Preliminary Product Specification  
1-800-255-7778  

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