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5962-9762501QXA PDF预览

5962-9762501QXA

更新时间: 2024-02-08 00:37:04
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路输出元件信息通信管理
页数 文件大小 规格书
12页 203K
描述
16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

5962-9762501QXA 技术参数

生命周期:Obsolete零件包装代码:DFP
包装说明:DFP,针数:48
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84其他特性:WITH DIRECTION CONTROL
系列:ABTJESD-30 代码:R-GDFP-F48
JESD-609代码:e0长度:15.875 mm
逻辑集成电路类型:BUS TRANSCEIVER位数:8
功能数量:2端口数量:2
端子数量:48最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK峰值回流温度(摄氏度):NOT APPLICABLE
传播延迟(tpd):4.4 ns认证状态:Qualified
筛选级别:MIL-PRF-38535 Class Q座面最大高度:3.05 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BICMOS温度等级:MILITARY
端子面层:TIN LEAD端子形式:FLAT
端子节距:0.635 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT APPLICABLE宽度:9.655 mm
Base Number Matches:1

5962-9762501QXA 数据手册

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PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Jun-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
5962-9762501QXA  
ACTIVE  
ACTIVE  
CFP  
WD  
48  
48  
1
TBD  
A42 SNPB  
N / A for Pkg Type  
74ABTH16245DGGRE4  
TSSOP  
DGG  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
74ABTH16245DGVRE4  
74ABTH16245DLRG4  
SN74ABTH16245DGGR  
SN74ABTH16245DGVR  
SN74ABTH16245DL  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TVSOP  
SSOP  
TSSOP  
TVSOP  
SSOP  
SSOP  
SSOP  
CFP  
DGV  
DL  
48  
48  
48  
48  
48  
48  
48  
48  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGG  
DGV  
DL  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74ABTH16245DLG4  
SN74ABTH16245DLR  
SNJ54ABTH16245WD  
DL  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
WD  
1
TBD  
A42 SNPB  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  

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