Datasheet > 5962-95595010HAX

5962-95595010HAX

更新时间： 2023-07-15 00:00:00

品牌	Logo	应用领域
美高森美 - MICROSEMI		静态存储器
页数	文件大小	规格书
10页	437K
描述
SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 22.40 MM, 5.08 MM HEIGHT, CERAMIC, QFP-68

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5962-95595010HAX 数据手册

WS128K32-XXX

White Electronic Designs

128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595

Commercial, Industrial and Military Temperature

Ranges

FEATURES

Access Times of 15, 17, 20, 25, 35, 45, 55ns

MIL-STD-883 Compliant Devices Available

Packaging

5 Volt Power Supply

Low Power CMOS

TTL Compatible Inputs and Outputs

66 pin, PGA Type, 1ꢀ075" square, Hermetic Ce

ramic HIP (Package 400)

68 lead, 40mm CQFP (G4T)¹, 3ꢀ56mm (0ꢀ140")

(Package 502)

Built in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Weight:

WS128K32-XG1UX¹- 5 grams typical

WS128K32-XG1TX - 5 grams typical

WS128K32-XG2UX - 8 grams typical

WS128K32-XG2LX - 8 grams typical

WS128K32-XH1X - 13 grams typical

WS128K32-XG4TX¹- 20 grams typical

68 lead, 22ꢀ4mm CQFP (G2U), 3ꢀ56mm (0ꢀ140"),

(Package 510)

68 lead, 22ꢀ4mm (0ꢀ880") square, CQFP (G2L),

5ꢀ08mm (0ꢀ200") high, (Package 528)ꢀ

68 lead, 23ꢀ9mm Low Profile CQFP (G1U)¹,

3ꢀ57mm (0ꢀ140"), (Package 519)

68 lead, 23ꢀ9mm Low Profile CQFP (G1T), 4ꢀ06

mm (0ꢀ160"), (Package 524)

Organized as 128Kx32; User Configurable as

256Kx16 or 512Kx8

All devices are upgradeable to 512Kx32

Note 1: Package Not Recommended For New Design

FIGꢀ 1 PIN CONFIGURATION FOR WS128K32N-XH1X

TOP VIEW

PIN DESCRIPTION

I/O0-31 Data Inputs/Outputs

A0-16 Address Inputs

WE1-4

CS1-4

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

VCC

GND

Not Connected

BLOCK DIAGRAM

May 2003 Revꢀ 12

White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom

12 3 4 5 6 7...10

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