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5962-9469203QHA PDF预览

5962-9469203QHA

更新时间: 2024-02-21 18:43:05
品牌 Logo 应用领域
德州仪器 - TI 运算放大器放大器电路
页数 文件大小 规格书
76页 1547K
描述
Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

5962-9469203QHA 技术参数

生命周期:Active零件包装代码:DIP
包装说明:CERAMIC, DIP-8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.24
放大器类型:OPERATIONAL AMPLIFIER最大平均偏置电流 (IIB):0.0008 µA
标称共模抑制比:88 dB最大输入失调电压:1500 µV
JESD-30 代码:R-GDIP-T8JESD-609代码:e0
长度:9.58 mm负供电电压上限:-8 V
标称负供电电压 (Vsup):-5 V功能数量:2
端子数量:8最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Qualified筛选级别:MIL-STD-883 Class Q
座面最大高度:5.08 mm标称压摆率:0.55 V/us
子类别:Operational Amplifier供电电压上限:8 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED标称均一增益带宽:730 kHz
宽度:7.62 mmBase Number Matches:1

5962-9469203QHA 数据手册

 浏览型号5962-9469203QHA的Datasheet PDF文件第1页浏览型号5962-9469203QHA的Datasheet PDF文件第3页浏览型号5962-9469203QHA的Datasheet PDF文件第4页浏览型号5962-9469203QHA的Datasheet PDF文件第5页浏览型号5962-9469203QHA的Datasheet PDF文件第6页浏览型号5962-9469203QHA的Datasheet PDF文件第7页 
TLC226x, TLC226xA  
Advanced LinCMOS RAIL-TO-RAIL  
OPERATIONAL AMPLIFIERS  
SLOS177D FEBRUARY 1997 REVISED MARCH 2001  
TLC2262 AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
IO  
SMALL  
OUTLINE  
(D)  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLATPACK  
(U)  
T
A
TSSOP  
(PW)  
AT 25°C  
(JG)  
(P)  
0°C to 70°C  
2.5 mV  
TLC2262CD  
TLC2262CP  
TLC2262CPW  
950 µV  
2.5 mV  
TLC2262AID  
TLC2262ID  
TLC2262AIP  
TLC2262IP  
TLC2262AIPW  
40°C to 125°C  
950 µV  
2.5 mV  
TLC2262AQD  
TLC2262QD  
40°C to 125°C  
55°C to 125°C  
950 µV  
2.5 mV  
TLC2262AMFK TLC2262AMJG  
TLC2262MFK TLC2262MJG  
TLC2262AMU  
TLC2262MU  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR). The PW package is available only left-end taped  
and reeled. Chips are tested at 25°C.  
TLC2264 AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
max  
IO  
SMALL  
OUTLINE  
(D)  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLATPACK  
(W)  
T
A
TSSOP  
(PW)  
AT 25°C  
(J)  
(N)  
0°C to 70°C  
2.5 mV  
TLC2264CD  
TLC2264CN  
TLC2264CPW  
950 µV  
2.5 mV  
TLC2264AID  
TLC2264ID  
TLC2264AIN  
TLC2264IN  
TLC2264AIPW  
40°C to 125°C  
950 µV  
2.5 mV  
TLC2264AQD  
TLC2264QD  
40°C to 125°C  
55°C to 125°C  
950 µV  
2.5 mV  
TLC2264AMFK TLC2264AMJ  
TLC2264MFK TLC2264MJ  
TLC2264AMW  
TLC2264MW  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2264CDR). The PW package is available only left-end taped  
and reeled. Chips are tested at 25°C.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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