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5962-9321901QSA PDF预览

5962-9321901QSA

更新时间： 2024-02-21 03:14:12
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器锁存器逻辑集成电路输出元件信息通信管理
页数 文件大小 规格书
20页 760K
描述
OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS

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5962-9321901QSA 技术参数

生命周期：Active零件包装代码：DFP
包装说明：DFP,针数：20
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.78其他特性：BROADSIDE VERSION OF 373
系列：ABTJESD-30 代码：R-GDFP-F20
逻辑集成电路类型：BUS DRIVER位数：8
功能数量：1端口数量：2
端子数量：20最高工作温度：125 °C
最低工作温度：-55 °C输出特性：3-STATE
输出极性：TRUE封装主体材料：CERAMIC, GLASS-SEALED
封装代码：DFP封装形状：RECTANGULAR
封装形式：FLATPACK传播延迟（tpd）：7.5 ns
认证状态：Qualified筛选级别：MIL-PRF-38535 Class Q
座面最大高度：2.286 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：4.5 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：BICMOS
温度等级：MILITARY端子形式：FLAT
端子节距：1.27 mm端子位置：DUAL
宽度：6.731 mmBase Number Matches：1

5962-9321901QSA 数据手册

 浏览型号5962-9321901QSA的Datasheet PDF文件第4页浏览型号5962-9321901QSA的Datasheet PDF文件第5页浏览型号5962-9321901QSA的Datasheet PDF文件第6页浏览型号5962-9321901QSA的Datasheet PDF文件第8页浏览型号5962-9321901QSA的Datasheet PDF文件第9页浏览型号5962-9321901QSA的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
LCCC  
CDIP  
CFP  
Drawing  
5962-9321901Q2A  
5962-9321901QRA  
5962-9321901QSA  
SN74ABT573ADBLE  
SN74ABT573ADBR  
ACTIVE  
ACTIVE  
FK  
J
20  
20  
20  
20  
20  
1
1
1
None  
None  
None  
None  
Call TI  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
Call TI  
ACTIVE  
W
OBSOLETE  
ACTIVE  
SSOP  
SSOP  
DB  
DB  
2000  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
SN74ABT573ADW  
SN74ABT573ADWR  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
DW  
DW  
20  
20  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-250C-1 YEAR/  
Level-1-235C-UNLIM  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-250C-1 YEAR/  
Level-1-235C-UNLIM  
SN74ABT573AGQNR  
SN74ABT573AN  
ACTIVE  
ACTIVE  
VFBGA  
PDIP  
GQN  
N
20  
20  
1000  
20  
None  
SNPB  
Level-1-240C-UNLIM  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
SN74ABT573ANSR  
SN74ABT573APW  
ACTIVE  
ACTIVE  
SO  
NS  
20  
20  
2000  
70  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
TSSOP  
PW  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
SN74ABT573APWLE  
SN74ABT573APWR  
OBSOLETE TSSOP  
PW  
PW  
20  
20  
None  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
SN74ABT573ARGYR  
SN74ABT573AZQNR  
QFN  
RGY  
ZQN  
20  
20  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
VFBGA  
1000  
Pb-Free  
(RoHS)  
SNAGCU  
Level-1-260C-UNLIM  
SNJ54ABT573FK  
SNJ54ABT573J  
SNJ54ABT573W  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CFP  
FK  
J
20  
20  
20  
1
1
1
None  
None  
None  
Call TI  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
Level-NC-NC-NC  
W
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
Addendum-Page 1  
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