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5962-8955001CA PDF预览

5962-8955001CA

更新时间: 2024-02-20 08:37:22
品牌 Logo 应用领域
德州仪器 - TI 栅极逻辑集成电路石英晶振输入元件
页数 文件大小 规格书
16页 527K
描述
QUADRUPLE 2-INPUT EXCLUSIVE-OR GATES

5962-8955001CA 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.38Is Samacsys:N
JESD-609代码:e4逻辑集成电路类型:XOR GATE
认证状态:Qualified端子面层:GOLD
Base Number Matches:1

5962-8955001CA 数据手册

 浏览型号5962-8955001CA的Datasheet PDF文件第4页浏览型号5962-8955001CA的Datasheet PDF文件第5页浏览型号5962-8955001CA的Datasheet PDF文件第6页浏览型号5962-8955001CA的Datasheet PDF文件第8页浏览型号5962-8955001CA的Datasheet PDF文件第9页浏览型号5962-8955001CA的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Jul-2006  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  

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