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5962-8409801VCA PDF预览

5962-8409801VCA

更新时间： 2024-01-19 02:22:37
品牌 Logo 应用领域
德州仪器 - TI 栅极
页数 文件大小 规格书
21页 1163K
描述
HEX INVERTERS

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5962-8409801VCA 技术参数

生命周期：Obsolete零件包装代码：DFP
包装说明：DFP,针数：14
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.29系列：HC/UH
JESD-30 代码：R-CDFP-F14逻辑集成电路类型：INVERTER
功能数量：6输入次数：1
端子数量：14最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：DFP封装形状：RECTANGULAR
封装形式：FLATPACK传播延迟（tpd）：145 ns
认证状态：Not Qualified最大供电电压 (Vsup)：6 V
最小供电电压 (Vsup)：2 V标称供电电压 (Vsup)：4.5 V
表面贴装：YES技术：CMOS
温度等级：MILITARY端子形式：FLAT
端子位置：DUALBase Number Matches：1

5962-8409801VCA 数据手册

 浏览型号5962-8409801VCA的Datasheet PDF文件第4页浏览型号5962-8409801VCA的Datasheet PDF文件第5页浏览型号5962-8409801VCA的Datasheet PDF文件第6页浏览型号5962-8409801VCA的Datasheet PDF文件第8页浏览型号5962-8409801VCA的Datasheet PDF文件第9页浏览型号5962-8409801VCA的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
SN74HC04PWRE4  
SN74HC04PWRG4  
SN74HC04PWT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
LCCC  
PW  
PW  
PW  
PW  
PW  
FK  
14  
14  
14  
14  
14  
20  
2000  
2000  
250  
250  
250  
1
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
POST-PLATE  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85 HC04  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
HC04  
HC04  
HC04  
HC04  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
SN74HC04PWTE4  
SN74HC04PWTG4  
SNJ54HC04FK  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
TBD  
-55 to 125 84098012A  
SNJ54HC  
04FK  
SNJ54HC04J  
SNJ54HC04W  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125 8409801CA  
SNJ54HC04J  
W
-55 to 125 8409801DA  
SNJ54HC04W  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Addendum-Page 3  
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