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5962-8404801VDA PDF预览

5962-8404801VDA

更新时间： 2024-01-05 18:44:47
品牌 Logo 应用领域
德州仪器 - TI 栅逻辑集成电路
页数 文件大小 规格书
17页 683K
描述
Triple 3-Input Positive-AND Gates 14-CFP

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5962-8404801VDA 技术参数

生命周期：Obsolete零件包装代码：DFP
包装说明：DFP,针数：14
Reach Compliance Code：unknownHTS代码：8542.39.00.01
风险等级：5.61系列：HC/UH
JESD-30 代码：R-CDFP-F14JESD-609代码：e0
长度：9.21 mm逻辑集成电路类型：AND GATE
功能数量：3输入次数：3
端子数量：14最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装代码：DFP封装形状：RECTANGULAR
封装形式：FLATPACK峰值回流温度（摄氏度）：NOT SPECIFIED
传播延迟（tpd）：150 ns认证状态：Not Qualified
筛选级别：MIL-STD-883座面最大高度：2.03 mm
最大供电电压 (Vsup)：6 V最小供电电压 (Vsup)：2 V
标称供电电压 (Vsup)：5 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子面层：Tin/Lead (Sn/Pb)端子形式：FLAT
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：6.285 mm

5962-8404801VDA 数据手册

 浏览型号5962-8404801VDA的Datasheet PDF文件第4页浏览型号5962-8404801VDA的Datasheet PDF文件第5页浏览型号5962-8404801VDA的Datasheet PDF文件第6页浏览型号5962-8404801VDA的Datasheet PDF文件第8页浏览型号5962-8404801VDA的Datasheet PDF文件第9页浏览型号5962-8404801VDA的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
SN74HC11PWRE4  
SN74HC11PWRG4  
SN74HC11PWT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
14  
14  
14  
14  
14  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74HC11PWTE4  
SN74HC11PWTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SNJ54HC11FK  
SNJ54HC11J  
SNJ54HC11W  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CFP  
FK  
J
20  
14  
14  
1
1
1
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
W
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
1...45678910...17

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