Datasheet > 53229-0201

53229-0201

更新时间： 2023-02-26 15:22:36

品牌	Logo	应用领域
莫仕 - MOLEX		/
页数	文件大小	规格书
3页	204K
描述
Board Euro Connector, 20 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle

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53229-0201 数据手册

2.54mm (.100") Pitch

DIN 41612

FEATURES AND SPECIFICATIONS

Features and Beneﬁts

Sizes 16 to 64 circuits

DIN 41612 and IEC 603-2 compatible

Two points of contact provide low insertion force and

reliable connection

Electrical

Voltage: 300V

Header

Current: 2.0A

Contact Resistance: 20mΩ max.

Dielectric Withstanding Voltage: 1000V AC

Insulation Resistance: 10⁶MΩ min.

53229/53315

Vertical

Reference Information

Packaging: Tray

UL File No.: E29179

CSA File No.: LR19980

Mates With: 52299 and 52479

Designed In: Millimeters

Physical

Housing: Glass-ﬁlled PBT, UL 94V-O

Contact: Brass

Metal Peg: Phosphor Bronze

Plating: See Table

Operating Temperature: -55 to +105˚C

CATALOG DRAWING (FOR REFERENCE ONLY)

Note: 53315 shown

ORDERING INFORMATION AND DIMENSIONS

Order No.

Dimension

Circuits

Without Metal Peg

53229-016X

53229-020X

53229-032X

53229-044X

With Metal Peg

53315-016X

53315-020X

53315-032X

53315-044X

53315-050X

53315-064X

33.84 (1.332)

38.92 (1.532)

54.16 (2.132)

69.40 (2.732)

77.02 (3.032)

94.80 (3.732)

17.78 (.700)

22.86 (.900)

38.10 (1.500)

53.34 (2.100)

60.96 (2.400)

78.74 (3.100)

29.04 (1.143)

34.12 (1.343)

49.36 (1.943)

64.60 (2.543)

72.22 (2.843)

90.00 (3.543)

53229-050X

53229-064X

Replace X with plating no., 0-3

Plating No. 0: 0.1µm Gold with Nickel underplate overall and Tin/Lead in solder area

Plating No. 1: 0.3µm Gold with Nickel underplate overall and Tin/Lead in solder area

Plating No. 2: 0.5µm Gold with Nickel underplate overall and Tin/Lead in solder area

Plating No. 3: 0.76µm Gold with Nickel underplate overall and Tin/Lead in solder area

J-170

MX01

12 3

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