Datasheet > 4816P-T01-105

4816P-T01-105

更新时间： 2024-02-15 13:57:11

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页数	文件大小	规格书
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RESISTOR NETWORK 1M

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中文翻译

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技术参数
数据手册

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4816P-T01-105 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	SMT, 2244
Reach Compliance Code：	not_compliant	Factory Lead Time：	5 weeks
风险等级：	0.72	Is Samacsys：	N
构造：	Chip	元件功耗：	0.16 W
第一元件电阻：	1000000 Ω	JESD-609代码：	e2
引线间距：	1.27 mm	安装特点：	SURFACE MOUNT
网络类型：	ISOLATED	元件数量：	1
功能数量：	8	端子数量：	16
最高工作温度：	125 °C	最低工作温度：	-55 °C
封装高度：	2.03 mm	封装长度：	11.18 mm
封装形状：	RECTANGULAR PACKAGE	封装形式：	SMT
封装宽度：	5.59 mm	包装方法：	TUBE
额定功率耗散 (P)：	1.28 W	额定温度：	70 °C
参考标准：	AEC-Q200	电阻：	1000000 Ω
电阻器类型：	ARRAY/NETWORK RESISTOR	尺寸代码：	2244
子类别：	ARRAY/NETWORK RESISTOR	表面贴装：	YES
技术：	METAL GLAZE/THICK FILM	温度系数：	100 ppm/ °C
温度系数跟踪：	50 ppm/ °C	端子面层：	Tin/Copper (Sn/Cu)
端子形状：	GULL WING	容差：	2%
工作电压：	50 V	Base Number Matches：	1

4816P-T01-105 数据手册

Soldering And Cleaning Processes

This application note is designed to provide step-by-step processing recommendations. It covers

the popular soldering process currently in use and provides recommendations and cautions for

each step. Since many variations of time, temperature, processes, cleaning agents and board

types in use, you will want to verify your own system. Bourns does not recommend the backside

mounting of passive components.

The process steps, recommendations and cautions are based on Bourns surveys of users, equip-

ment manufacturers and materials suppliers. No warranty expressed or implied is made in regards

to the following recommendations.

1 2 3 4 5

Solder Paste

Printing

Adhesive

Application

Network

Placement

Adhesive

Cure

Flux

Application

Reflow; Convection,

IR and Vapor Phase

Flow (Wave)

GENERAL

Heat/time cure should be

accomplished using either

an infrared radiation or a

convection oven.

Use the optimum

The adhesive must hold the

unit in correct orientation

upon placement and main-

tain the correct position

during any physical han-

dling before the final sol-

dering process.

Use pick-and-place equip-

ment with a vacuum nozzle

ID that allows adequate

suction to pick the unit out

of the pocket cavity.

Use the correct flux to

remove surface oxides,

prevent re-oxidation and

promote wetting.

solder paste for the pattern,

printing process, and sol-

der joint quality.

RECOMMENDED

Cure using the temperature

profile specified by the adhe-

sive manufacturer.

RECOMMENDED

Typical solder paste alloy is

63Sn/37Pb. RMA,No-Clean

or Halide Free Water

Soluble fluxes should be

used.

RMA (Rosin Mildly

Activated) flux or Halide

Free Water Soluble flux is

recommended.

Ensure nozzle inside diam-

eter and vacuum levels are

adequate to maintain suc-

tion and part alignment.

RECOMMENDED

To assure positional stabili-

ty, place a single dot of

epoxy under the unit.

CAUTION

Use sufficient cure time to

ensure complete adhesive

transition from fluid to solid.

CAUTION

Avoid fluxes with Halide

activators.

CAUTION

Ensure parts are placed so

that all leads are centered

on the solder pads.

Since solder paste usually

contains a high percentage

of activators, you must

ensure adequate cleaning

to remove all residues.

Consult your solder paste

supplier for cleaning meth-

ods. When cleaning addi-

tives are needed, only

Care should be taken to

assure the placed units are

not exposed to temperatures

in excess of the manufactur-

er's maximum.

Epoxy

Align the leads with the sol-

der belt direction of travel

to avoid the part body cre-

ating a thermal shadowing

effect.

CAUTION

Use sufficient adhesive to

assure stability through the

cure process.

Do not exceed the maximum

temperature rating of the

component.

those that are Halide Free

should be used.

Excessive placement force

to the part should be avoid-

ed to minimize the risk of

package damage.

Avoid overflow of epoxy

onto solder pads and termi-

nal areas.

Excessive curing before

placement may not allow

full seating of the part

causing incomplete solder

connections.

Specifications are subject to change without notice.

336

1...57 58 596061 62

中文翻译

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与4816P-T01-105相关器件

型号	品牌	获取价格	描述	数据表
4816P-T01-105F	BOURNS	获取价格	Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 1000000ohm, 50V, 1% +/-To
4816P-T01-105FLF	BOURNS	获取价格	Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 1000000ohm, 50V, 1% +/-To
4816P-T01-105LF	BOURNS	获取价格	Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 1000000ohm, 50V, 2% +/-To
4816P-T01-151LF	BOURNS	获取价格	4800P Series - Thick Film Surface Mounted Medium Body
4816P-T01-152LF	BOURNS	获取价格	Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 1500ohm, 50V, 2% +/-Tol,
4816P-T01-153LF	BOURNS	获取价格	Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 15000ohm, 50V, 2% +/-Tol,
4816P-T01-181LF	BOURNS	获取价格	Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 180ohm, 50V, 2% +/-Tol, 1
4816P-T01-220	BOURNS	获取价格	4800P Series - Thick Film Surface Mounted Medium Body
4816P-T01-221	BOURNS	获取价格	Array/Network Resistor, Isolated, Metal Glaze/thick Film, 1.28W, 220ohm, 50V, 2% +/-Tol, 1
4816P-T01-222	ETC	获取价格	WIDERSTAND NETZWERK DICKFILM 2K2 5ST

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