Datasheet > 4606X-AP4-332

4606X-AP4-332

更新时间： 2022-05-01 10:49:34

品牌	Logo	应用领域
伯恩斯 - BOURNS		电阻器网络
页数	文件大小	规格书
62页	1878K
描述
Resistor Networks Product Selection Guide

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数据手册

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4606X-AP4-332 数据手册

w w w . b o u r n s

. c o m

Resistor Networks

Product Selection Guide...........................................................278

II. Popular Resistance Codes........................................................284

III. Thick Film Products

Through-hole Packages

Molded DIPs...................................................................286

Molded SIPs...................................................................288

Conformal SIPs ..............................................................294

Surface Mount Packages

For a complete listing of thick film products

in stock and readily available through distri-

bution, see page 284.

Wide Body......................................................................300

Medium Body.................................................................302

Ordering Guide...............................................................304

RC Networks

T-Filters (EMI/RFI Low-Pass Filters)...............................305

RC Terminators ..............................................................307

ECL Terminators .............................................................309

Capacitor Networks ........................................................312

IV. Precision Thin-Film-on-Ceramic Products

Through-hole Packages ......................................................313

Surface Mount Packages ....................................................318

VI. Designer’s Guide and Application Notes

EMI/RFI Filters................................................................320

RC Terminator Networks ................................................322

Emitter Coupled Logic Terminators ................................324

Dual Terminator Resistor Networks................................326

SCSI ...............................................................................327

R/2R Ladder Networks ...................................................330

DRAM Applications ........................................................331

Thin Film Applications ....................................................334

Soldering and Cleaning Processes .................................336

Specifications are subject to change without notice.

277

12 3 4 5 6 7...62

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